TW294823B - - Google Patents

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Publication number
TW294823B
TW294823B TW083110221A TW83110221A TW294823B TW 294823 B TW294823 B TW 294823B TW 083110221 A TW083110221 A TW 083110221A TW 83110221 A TW83110221 A TW 83110221A TW 294823 B TW294823 B TW 294823B
Authority
TW
Taiwan
Prior art keywords
processing
liquid
tank
patent application
item
Prior art date
Application number
TW083110221A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1697994A external-priority patent/JP3127073B2/ja
Priority claimed from JP04039694A external-priority patent/JP3273282B2/ja
Priority claimed from JP22116194A external-priority patent/JP3298037B2/ja
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW294823B publication Critical patent/TW294823B/zh

Links

Classifications

    • H10P52/00—
    • H10P72/0408—
    • F26B21/471—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW083110221A 1993-10-29 1994-11-04 TW294823B (enExample)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP29433393 1993-10-29
JP1697994A JP3127073B2 (ja) 1994-01-17 1994-01-17 洗浄装置及び洗浄方法
JP04039694A JP3273282B2 (ja) 1994-02-15 1994-02-15 処理装置
JP22116194A JP3298037B2 (ja) 1994-08-23 1994-08-23 乾燥処理装置

Publications (1)

Publication Number Publication Date
TW294823B true TW294823B (enExample) 1997-01-01

Family

ID=27456687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110221A TW294823B (enExample) 1993-10-29 1994-11-04

Country Status (3)

Country Link
US (2) US5575079A (enExample)
KR (2) KR100338534B1 (enExample)
TW (1) TW294823B (enExample)

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US5735962A (en) * 1996-01-11 1998-04-07 S3 Service Support Specialties, Inc. Silicon substrate cleaning method and apparatus
JPH10144650A (ja) * 1996-11-11 1998-05-29 Mitsubishi Electric Corp 半導体材料の洗浄装置
JP3230051B2 (ja) * 1997-05-16 2001-11-19 東京エレクトロン株式会社 乾燥処理方法及びその装置
JPH10321585A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US5807439A (en) * 1997-09-29 1998-09-15 Siemens Aktiengesellschaft Apparatus and method for improved washing and drying of semiconductor wafers
US6108932A (en) * 1998-05-05 2000-08-29 Steag Microtech Gmbh Method and apparatus for thermocapillary drying
US6158141A (en) * 1998-05-07 2000-12-12 Sony Corporation Apparatus and method for drying semiconductor substrate
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6955516B2 (en) * 2001-11-02 2005-10-18 Applied Materials, Inc. Single wafer dryer and drying methods
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6192600B1 (en) 1999-09-09 2001-02-27 Semitool, Inc. Thermocapillary dryer
US7364625B2 (en) * 2000-05-30 2008-04-29 Fsi International, Inc. Rinsing processes and equipment
GB2368358B (en) * 2000-10-23 2004-10-13 Mastenbroek Ltd Trenching method and apparatus
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JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100599435B1 (ko) * 2004-05-17 2006-07-14 주식회사 하이닉스반도체 기판을 세정하기 위한 장치
WO2006014293A2 (en) * 2004-07-02 2006-02-09 Aqualizer, Llc Moisture condensation control system
CN101409226B (zh) * 2005-05-12 2011-03-30 应用材料股份有限公司 用于在清洁模块中垂直转移半导体基材的方法及设备
KR100928495B1 (ko) * 2005-06-20 2009-11-26 엘지디스플레이 주식회사 배향막 인쇄 마스크용 지그 장치와, 이를 적용한 배향막인쇄 마스크용 세정 장비 및 이를 이용한 마스크 세정 방법
WO2006137330A1 (ja) 2005-06-22 2006-12-28 Tokyo Electron Limited 基板処理装置および基板処理方法
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4527670B2 (ja) 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
US20080066339A1 (en) * 2006-09-14 2008-03-20 Mike Wallis Apparatus and method for drying a substrate
US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
KR100875790B1 (ko) 2006-12-22 2008-12-26 동부일렉트로닉스 주식회사 반도체 제조설비용 액조
JP4805862B2 (ja) 2007-02-21 2011-11-02 富士通セミコンダクター株式会社 基板処理装置、基板処理方法、及び半導体装置の製造方法
US7479463B2 (en) * 2007-03-09 2009-01-20 Tokyo Electron Limited Method for heating a chemically amplified resist layer carried on a rotating substrate
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
US8002901B1 (en) 2009-01-15 2011-08-23 Wd Media, Inc. Temperature dependent pull speeds for drying of a wet cleaned workpiece
US8171949B1 (en) 2009-03-06 2012-05-08 Wd Media, Inc. Fluid flow management
JP5318670B2 (ja) * 2009-06-09 2013-10-16 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラムおよび記憶媒体
US20110186088A1 (en) * 2010-01-31 2011-08-04 Miller Kenneth C Substrate nest with drip remover
JP5477131B2 (ja) * 2010-04-08 2014-04-23 東京エレクトロン株式会社 基板処理装置
US8790531B2 (en) * 2011-07-08 2014-07-29 Alvin Gabriel Stern High purity, environmentally clean method and apparatus, for high rate, liquid anisotropic etching of single crystal silicon or etching of polycrystalline silicon, using an overpressure of ammonia gas above aqueous ammonium hydroxide
KR102081709B1 (ko) * 2012-10-04 2020-02-27 세메스 주식회사 기판처리장치 및 약액냉각방법
US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
KR101860631B1 (ko) * 2015-04-30 2018-05-23 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법
JP6367763B2 (ja) * 2015-06-22 2018-08-01 株式会社荏原製作所 ウェーハ乾燥装置およびウェーハ乾燥方法
DE102015214711A1 (de) 2015-07-31 2017-02-02 Dürr Systems Ag Behandlungsanlage und Verfahren zum Behandeln von Werkstücken
DE102015214706A1 (de) * 2015-07-31 2017-02-02 Dürr Systems Ag Behandlungsanlage und Verfahren zum Behandeln von Werkstücken
JP6659368B2 (ja) * 2016-01-15 2020-03-04 株式会社荏原製作所 洗浄装置、基板処理装置、および基板処理方法
JP6568838B2 (ja) * 2016-10-18 2019-08-28 上村工業株式会社 乾燥装置
US10775057B2 (en) * 2018-08-20 2020-09-15 Therma-Stor, Llc Dehumidification drainage system with mist eliminator
JP7660446B2 (ja) * 2021-06-29 2025-04-11 株式会社荏原製作所 基板乾燥装置
CN115881578A (zh) * 2021-09-29 2023-03-31 盛美半导体设备(上海)股份有限公司 基板处理装置
KR102776612B1 (ko) * 2022-12-29 2025-03-07 세메스 주식회사 기판 처리 장치 및 그 제어 방법
KR102715178B1 (ko) * 2024-04-08 2024-10-11 주식회사 에이아이로보틱스 탈이온수 수조가 결합된 웨이퍼 이송용 자율주행 차량
US20250357099A1 (en) * 2024-05-16 2025-11-20 Tokyo Electron Limited Wafer cleaning method and system

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JPS6123324A (ja) * 1984-07-11 1986-01-31 Hitachi Ltd 乾燥装置
US4601115A (en) * 1985-04-26 1986-07-22 Westinghouse Electric Corp. Method and apparatus for steam drying of low-rank coals using a rotary cylindrical vessel
JPS62106630A (ja) * 1985-11-05 1987-05-18 Hitachi Ltd 処理装置
US5142873A (en) * 1990-02-15 1992-09-01 E. I. Du Pont De Nemours And Company Vapor control system for vapor degreasing/defluxing equipment
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
US5246023A (en) * 1990-04-24 1993-09-21 Electronic Controls Design, Inc. Method and apparatus to clean and cleanliness test printed circuit boards
US5456022A (en) * 1992-01-13 1995-10-10 Jwi, Inc. Batch-type sludge drier
US5243769A (en) * 1992-06-26 1993-09-14 Yazaki Corporation Process for rapidly drying a wet, porous gel monolith
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置

Also Published As

Publication number Publication date
US5671544A (en) 1997-09-30
US5575079A (en) 1996-11-19
KR950012610A (ko) 1995-05-16
KR100338534B1 (ko) 2002-09-27
KR100357316B1 (ko) 2002-10-19

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