KR100296646B1 - 프로우브시스템및프로우브방법 - Google Patents

프로우브시스템및프로우브방법 Download PDF

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Publication number
KR100296646B1
KR100296646B1 KR1019950007253A KR19950007253A KR100296646B1 KR 100296646 B1 KR100296646 B1 KR 100296646B1 KR 1019950007253 A KR1019950007253 A KR 1019950007253A KR 19950007253 A KR19950007253 A KR 19950007253A KR 100296646 B1 KR100296646 B1 KR 100296646B1
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KR
South Korea
Prior art keywords
probe
imaging means
stage
chip
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950007253A
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English (en)
Korean (ko)
Other versions
KR950033489A (ko
Inventor
구지모토히로
요시오카하루히코
아카이케신지
다카하시시게아키
Original Assignee
히가시 데쓰로
동경 엘렉트론 주식회사
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Filing date
Publication date
Priority claimed from JP6085759A external-priority patent/JP2986141B2/ja
Priority claimed from JP10461594A external-priority patent/JP3156192B2/ja
Priority claimed from JP6104614A external-priority patent/JP2986142B2/ja
Application filed by 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 히가시 데쓰로
Publication of KR950033489A publication Critical patent/KR950033489A/ko
Application granted granted Critical
Publication of KR100296646B1 publication Critical patent/KR100296646B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1019950007253A 1994-03-31 1995-03-31 프로우브시스템및프로우브방법 Expired - Lifetime KR100296646B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP94-85759 1994-03-31
JP6085759A JP2986141B2 (ja) 1994-03-31 1994-03-31 プローブ装置
JP94-104615 1994-04-19
JP10461594A JP3156192B2 (ja) 1994-04-19 1994-04-19 プローブ方法及びその装置
JP6104614A JP2986142B2 (ja) 1994-04-19 1994-04-19 プローブ方法
JP94-104614 1994-04-19

Publications (2)

Publication Number Publication Date
KR950033489A KR950033489A (ko) 1995-12-26
KR100296646B1 true KR100296646B1 (ko) 2001-10-24

Family

ID=27304954

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950007253A Expired - Lifetime KR100296646B1 (ko) 1994-03-31 1995-03-31 프로우브시스템및프로우브방법

Country Status (5)

Country Link
US (2) US5585738A (cs3-)
EP (1) EP0675366B1 (cs3-)
KR (1) KR100296646B1 (cs3-)
DE (1) DE69533910T2 (cs3-)
TW (1) TW278140B (cs3-)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100709963B1 (ko) * 2006-10-20 2007-04-25 주식회사 엠디플렉스 다수의 캐비티를 구비한 연성회로기판의 검사 시스템 및검사 방법
KR100910668B1 (ko) 2006-05-31 2009-08-04 도쿄엘렉트론가부시키가이샤 프로브선단의 검출 방법, 얼라인먼트 방법 및 이들방법들을 기록한 기억 매체, 및 프로브 장치
KR101099990B1 (ko) 2008-01-31 2011-12-28 도쿄엘렉트론가부시키가이샤 프로브 장치, 프로빙 방법, 및 기록 매체
KR20190115134A (ko) * 2018-03-29 2019-10-11 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법

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US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6104203A (en) * 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
JP2993398B2 (ja) * 1995-05-31 1999-12-20 ニチデン機械株式会社 ピックアップ装置及びピックアップ方法
US5946409A (en) * 1995-05-31 1999-08-31 Nec Corporation Pick-up apparatus and method for semiconductor devices
EP0837333A3 (en) * 1996-10-18 1999-06-09 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
TW399279B (en) 1997-05-08 2000-07-21 Tokyo Electron Limtied Prober and probe method
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
JP3206509B2 (ja) * 1997-08-22 2001-09-10 日本電気株式会社 表示パネル用プローブ装置
US6096567A (en) * 1997-12-01 2000-08-01 Electroglas, Inc. Method and apparatus for direct probe sensing
US6239590B1 (en) 1998-05-26 2001-05-29 Micron Technology, Inc. Calibration target for calibrating semiconductor wafer test systems
KR100319685B1 (ko) * 1999-05-01 2002-01-09 이건환 웨이퍼 프로빙 방법
US6208375B1 (en) * 1999-05-21 2001-03-27 Elite Engineering Corporation Test probe positioning method and system for micro-sized devices
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
JP2001144148A (ja) * 2001-05-12 2001-05-25 Advantest Corp 半導体試験装置のウエハマップ表示装置
US6718227B1 (en) * 1999-12-16 2004-04-06 Texas Instruments Incorporated System and method for determining a position error in a wafer handling device
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
JP4689070B2 (ja) * 2001-04-12 2011-05-25 ルネサスエレクトロニクス株式会社 半導体素子試験装置およびこれを用いた半導体素子試験方法
EP1432546A4 (en) 2001-08-31 2006-06-07 Cascade Microtech Inc OPTICAL TESTING APPARATUS
US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
AU2002237553A1 (en) * 2002-03-07 2003-09-16 Advantest Corporation Electronic component testing apparatus
US6794889B2 (en) * 2002-04-26 2004-09-21 Agilent Technologies, Inc. Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing
US7026832B2 (en) * 2002-10-28 2006-04-11 Dainippon Screen Mfg. Co., Ltd. Probe mark reading device and probe mark reading method
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
JP2004265895A (ja) * 2003-01-20 2004-09-24 Tokyo Electron Ltd 光学的測長器を備えたプローブ装置及びプローブ検査方法
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
JP5032170B2 (ja) * 2007-03-23 2012-09-26 東京エレクトロン株式会社 検査装置
DE102005034475A1 (de) * 2005-07-23 2007-01-25 Atmel Germany Gmbh Vorrichtung
JP4908138B2 (ja) * 2005-12-09 2012-04-04 ルネサスエレクトロニクス株式会社 プローブ検査装置
KR100805834B1 (ko) * 2006-01-09 2008-02-21 삼성전자주식회사 수광소자의 테스트 장치 및 그 방법
KR100772547B1 (ko) 2006-08-31 2007-11-02 주식회사 하이닉스반도체 반도체 장치 및 그의 테스트 방법
JP4939156B2 (ja) * 2006-09-19 2012-05-23 東京エレクトロン株式会社 位置合わせ対象物の再登録方法及びその方法を記録した記録媒体
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
JP5018183B2 (ja) * 2007-03-30 2012-09-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
CN101629808B (zh) * 2008-07-14 2011-05-18 京元电子股份有限公司 探针卡校正设备
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP5324534B2 (ja) * 2010-07-29 2013-10-23 株式会社日立ハイテクノロジーズ 検査方法及び装置
JP5260703B2 (ja) * 2011-06-10 2013-08-14 パナソニック株式会社 ３次元測定方法
US9019153B1 (en) * 2011-12-20 2015-04-28 Raytheon Company Calibration of large phased arrays using fourier gauge
CN102565677A (zh) * 2012-01-19 2012-07-11 嘉兴景焱智能装备技术有限公司 一种芯片的测试方法及其测试装置和该装置的使用方法
WO2014132855A1 (ja) * 2013-02-27 2014-09-04 株式会社東京精密 プローブ装置
JP6205225B2 (ja) 2013-03-25 2017-09-27 東京エレクトロン株式会社 基板検査装置及び基板温度調整方法
JP6137994B2 (ja) * 2013-08-28 2017-05-31 東京エレクトロン株式会社 デバイス検査方法
CN103472303B (zh) * 2013-09-10 2015-12-23 南通大学 基于多功能自动四探针测试仪的样品测试方法
JP6415281B2 (ja) * 2014-12-05 2018-10-31 東京エレクトロン株式会社 プローブ装置及びプローブ方法
CN105445643A (zh) * 2015-11-12 2016-03-30 杭州长川科技股份有限公司 一种全自动探针台图像定位系统
CN105513990B (zh) * 2015-12-07 2018-02-02 杭州长川科技股份有限公司 一种探针台图像定位装置及视觉对准方法
CN105486995B (zh) * 2015-12-07 2018-08-17 杭州长川科技股份有限公司 全自动探针台图像定位装置及视觉对准方法
TWI627414B (zh) * 2017-03-29 2018-06-21 Probe card detection method and system
US11287475B2 (en) * 2020-06-03 2022-03-29 Mpi Corporation Method for compensating to distance between probe tip and device under test after temperature changes
TWI790515B (zh) * 2020-12-21 2023-01-21 矽品精密工業股份有限公司 測試裝置及測試方法
TWI779978B (zh) * 2021-12-29 2022-10-01 卓金星 載物平台裝置及包括該載物平台裝置之量測裝置
CN118777697B (zh) * 2024-09-12 2024-12-10 成都云绎智创科技有限公司 电阻测试方法、设备、存储介质以及程序产品
CN118795320B (zh) * 2024-09-12 2024-11-15 天津市智华科技发展有限公司 一种芯片性能检测装置

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JPH0194631A (ja) * 1987-10-06 1989-04-13 Canon Inc ウエハプローバ
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910668B1 (ko) 2006-05-31 2009-08-04 도쿄엘렉트론가부시키가이샤 프로브선단의 검출 방법, 얼라인먼트 방법 및 이들방법들을 기록한 기억 매체, 및 프로브 장치
KR100709963B1 (ko) * 2006-10-20 2007-04-25 주식회사 엠디플렉스 다수의 캐비티를 구비한 연성회로기판의 검사 시스템 및검사 방법
KR101099990B1 (ko) 2008-01-31 2011-12-28 도쿄엘렉트론가부시키가이샤 프로브 장치, 프로빙 방법, 및 기록 매체
KR20190115134A (ko) * 2018-03-29 2019-10-11 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
KR102615555B1 (ko) * 2018-03-29 2023-12-19 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법

Also Published As

Publication number Publication date
EP0675366A2 (en) 1995-10-04
DE69533910D1 (de) 2005-02-17
EP0675366A3 (en) 1996-07-24
EP0675366B1 (en) 2005-01-12
TW278140B (cs3-) 1996-06-11
DE69533910T2 (de) 2005-12-15
US5640101A (en) 1997-06-17
KR950033489A (ko) 1995-12-26
US5585738A (en) 1996-12-17

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