KR100285408B1 - 기판처리장치,기판반송기 및 기판반송장치 - Google Patents

기판처리장치,기판반송기 및 기판반송장치 Download PDF

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Publication number
KR100285408B1
KR100285408B1 KR1019970049258A KR19970049258A KR100285408B1 KR 100285408 B1 KR100285408 B1 KR 100285408B1 KR 1019970049258 A KR1019970049258 A KR 1019970049258A KR 19970049258 A KR19970049258 A KR 19970049258A KR 100285408 B1 KR100285408 B1 KR 100285408B1
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South Korea
Prior art keywords
substrate
wafer
storage means
chamber
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1019970049258A
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English (en)
Korean (ko)
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KR19980025056A (ko
Inventor
아츠히코 스다
마코토 오자와
가즈유키 도요다
잇세이 마키구치
Original Assignee
엔도 마코토
고쿠사이 일렉트릭 컴퍼니 리미티드
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Publication of KR19980025056A publication Critical patent/KR19980025056A/ko
Application granted granted Critical
Publication of KR100285408B1 publication Critical patent/KR100285408B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019970049258A 1996-09-26 1997-09-26 기판처리장치,기판반송기 및 기판반송장치 Expired - Fee Related KR100285408B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-275581 1996-09-26
JP27558196A JP3947761B2 (ja) 1996-09-26 1996-09-26 基板処理装置、基板搬送機および基板処理方法

Publications (2)

Publication Number Publication Date
KR19980025056A KR19980025056A (ko) 1998-07-06
KR100285408B1 true KR100285408B1 (ko) 2001-04-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970049258A Expired - Fee Related KR100285408B1 (ko) 1996-09-26 1997-09-26 기판처리장치,기판반송기 및 기판반송장치

Country Status (4)

Country Link
US (1) US6053980A (enExample)
EP (1) EP0833374A3 (enExample)
JP (1) JP3947761B2 (enExample)
KR (1) KR100285408B1 (enExample)

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US6053980A (en) 2000-04-25
EP0833374A3 (en) 1998-05-13
KR19980025056A (ko) 1998-07-06
JPH10107121A (ja) 1998-04-24
EP0833374A2 (en) 1998-04-01
JP3947761B2 (ja) 2007-07-25

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