KR880701205A - 모듀울 반도체 웨이퍼 운반 및 처리 시스템 - Google Patents
모듀울 반도체 웨이퍼 운반 및 처리 시스템Info
- Publication number
- KR880701205A KR880701205A KR1019870701232A KR870701232A KR880701205A KR 880701205 A KR880701205 A KR 880701205A KR 1019870701232 A KR1019870701232 A KR 1019870701232A KR 870701232 A KR870701232 A KR 870701232A KR 880701205 A KR880701205 A KR 880701205A
- Authority
- KR
- South Korea
- Prior art keywords
- ports
- wafer
- port
- processing system
- conveying means
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Intermediate Stations On Conveyors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 시스템의 한 실시예의 개략 평면도.
Claims (8)
- 웨이퍼 운반 및 처리 시스템에 있어서, 각각 실의 내부와 실의 외부를 연통하는 복수의 제1포오트와 복수의 제2포오트를 구비하는 운반 진공실과, 상기 복수의 제1포오트와 복수의 제2포오트를 각각 개폐하기 위한 밸브 수단과, 상기 한개의 포오트용의 상기 밸브 수단의 외부측상에 상기 포오트의 하나와 연결되면서 상기 다른 밸브 포오트용의 상기 밸브 수단의 외부측상에 복수의 제1포오트 및 복수의 제2포오트의 다른 하나의 연결된 웨이퍼 처리실과, 상기 복수의 제1포오트의 제1선택 포오트로부터 상기 실과 그로부터 상기 복수의 제1포오트내의 선택된 어떤 포오트로 전송하기 위한 상기 실내의 제1운반수단과, 상기 복수의 제2포오트의 제 1선택 포오트로부터 상기 실과 그로부터 상기 복수의 제2포오트내의 제2선택 포오트로 전송하기 위한 상기 실내의 제2운반 수단과, 상기 복수의 제1포오트내에 제1선택 포오트로부터 상기 복수의 제2포오트내의 제2선택 포오트로 웨이퍼를 전송할 수 있도록 하기 위하여 상기 제1운반 수단으로부터 상기 제2운반수단으로 웨이퍼를 전송하기 위하여 상기 제1운반 수단과 상기 제2운반 수단이 협동하는 상기 실내의 전송수단을 포함하는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 전송 수단은 상기 복수의 제2포오트내의 제1선택 포오트로부터 상기 복수의 제1포오트내의 제 2선택 포오트로 웨이퍼를 전송할 수 있도록 하기 위하여 상기 제2운반 수단으로부터 상기 제1운반 수단으로 웨이퍼를 전송하기 위한 수단을 포함하는 것을 특징으로 하는 웨이퍼 운반 시스템 및 처리 시스템.
- 제1항에 있어서, 상기 전송 수단은 소요의 회전 방향에서 웨이퍼를 위치시키기 위한 수단을 포함하는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 제1운반 수단은 상기 복수의 제1포오트의 선택된 하나를 통하여 상기 실의 내부로부터 상기 실의 외부로 신장가능한 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 제1운반 수단을 상기 실의 제1부분에 위치하게 되고 상기 제2운반 수단은 상기 실의 제2부분에 위치하게 되며 상기 실의 상기 제1 및 제2부분은 각기 상기 제1 및 제2운반 수단에 대하여 치수가 정해지믈 상기 진공실의 제 1 및 제2부분의 총체적이 최소화되는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 전송 수단은 상기 제1 및 제2운반 수단사이에 위치하게 되는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 복수의 제1포오트의 2개의 포오트는 90°떨어져서 위치하는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.
- 제1항에 있어서, 상기 복수의 제1포오트는 최소 3개의 포오트를 포함 하는 것을 특징으로 하는 웨이퍼 운반 및 처리 시스템.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85673886A | 1986-04-28 | 1986-04-28 | |
US856,738 | 1986-04-28 | ||
US856738 | 1986-04-28 | ||
PCT/US1987/000799 WO1987006561A1 (en) | 1986-04-28 | 1987-04-06 | Modular semiconductor wafer transport and processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880701205A true KR880701205A (ko) | 1988-07-26 |
KR950012969B1 KR950012969B1 (ko) | 1995-10-24 |
Family
ID=25324388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870701232A KR950012969B1 (ko) | 1986-04-28 | 1987-04-06 | 모듀울 반도체 웨이퍼 운반 및 처리 시스템 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0267233B1 (ko) |
JP (1) | JP2639459B2 (ko) |
KR (1) | KR950012969B1 (ko) |
AT (1) | ATE84276T1 (ko) |
DE (1) | DE3783440T2 (ko) |
WO (1) | WO1987006561A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100285408B1 (ko) * | 1996-09-26 | 2001-04-02 | 엔도 마코토 | 기판처리장치,기판반송기 및 기판반송장치 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102495A (en) * | 1986-04-18 | 1992-04-07 | General Signal Corporation | Method providing multiple-processing of substrates |
US5308431A (en) * | 1986-04-18 | 1994-05-03 | General Signal Corporation | System providing multiple processing of substrates |
US5013385A (en) * | 1986-04-18 | 1991-05-07 | General Signal Corporation | Quad processor |
US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
JPS63252439A (ja) * | 1986-12-19 | 1988-10-19 | アプライド マテリアルズインコーポレーテッド | 多チャンバの統合処理システム |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
DE3702775A1 (de) * | 1987-01-30 | 1988-08-11 | Leybold Ag | Vorrichtung zum quasi-kontinuierlichen behandeln von substraten |
ES2163388T3 (es) * | 1988-05-24 | 2002-02-01 | Unaxis Balzers Ag | Instalacion de vacio. |
KR0152260B1 (ko) * | 1988-07-08 | 1998-12-15 | 고다까 토시오 | 프로우브 장치 |
DE68926480T2 (de) * | 1988-09-16 | 1996-10-02 | Texas Instruments Inc | Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung |
DE68911490T2 (de) * | 1988-11-30 | 1994-06-23 | Ibm | Beförderungsvorrichtung. |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
US5032052A (en) * | 1989-12-27 | 1991-07-16 | Xerox Corporation | Modular apparatus for cleaning, coating and curing photoreceptors in a dual planetary array |
US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
USRE39824E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
US5248371A (en) * | 1992-08-13 | 1993-09-28 | General Signal Corporation | Hollow-anode glow discharge apparatus |
US5764365A (en) | 1993-11-09 | 1998-06-09 | Nova Measuring Instruments, Ltd. | Two-dimensional beam deflector |
IL107549A (en) * | 1993-11-09 | 1996-01-31 | Nova Measuring Instr Ltd | Device for measuring the thickness of thin films |
KR100269097B1 (ko) * | 1996-08-05 | 2000-12-01 | 엔도 마코토 | 기판처리장치 |
US5908281A (en) * | 1996-09-20 | 1999-06-01 | Brooks Automation Inc. | Coaxial drive loader arm |
JP2000299367A (ja) | 1999-04-15 | 2000-10-24 | Tokyo Electron Ltd | 処理装置及び被処理体の搬送方法 |
US6918731B2 (en) | 2001-07-02 | 2005-07-19 | Brooks Automation, Incorporated | Fast swap dual substrate transport for load lock |
TW200524073A (en) | 2003-11-13 | 2005-07-16 | Applied Materials Inc | Kinematic pin with shear member and substrate carrier for use therewith |
US7720558B2 (en) | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
US7611322B2 (en) | 2004-11-18 | 2009-11-03 | Intevac, Inc. | Processing thin wafers |
JP5316521B2 (ja) * | 2010-03-31 | 2013-10-16 | 株式会社安川電機 | 基板搬送システム、基板処理システムおよび基板搬送ロボット |
KR20150034143A (ko) | 2012-07-04 | 2015-04-02 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
US9293355B2 (en) | 2012-11-09 | 2016-03-22 | Kabushiki Kaisha Yaskawa Denki | Substrate transfer system and substrate processing system |
US9149936B2 (en) | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
KR102503229B1 (ko) * | 2013-01-18 | 2023-02-23 | 퍼시몬 테크놀로지스 코포레이션 | 이송 장치 |
KR102285254B1 (ko) | 2013-08-26 | 2021-08-03 | 브룩스 오토메이션 인코퍼레이티드 | 기판 이송 장치 |
WO2016145305A2 (en) | 2015-03-12 | 2016-09-15 | Persimmon Technologies, Corp. | Robot with slaved end effector motion |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3865254A (en) * | 1973-05-21 | 1975-02-11 | Kasker Instr Inc | Prealignment system for an optical alignment and exposure instrument |
US4208159A (en) * | 1977-07-18 | 1980-06-17 | Tokyo Ohka Kogyo Kabushiki Kaisha | Apparatus for the treatment of a wafer by plasma reaction |
JPS54159964A (en) * | 1978-06-06 | 1979-12-18 | Shiroyama Kogyo Kk | Articulated arm type manipulator |
US4405435A (en) * | 1980-08-27 | 1983-09-20 | Hitachi, Ltd. | Apparatus for performing continuous treatment in vacuum |
GB8332394D0 (en) * | 1983-12-05 | 1984-01-11 | Pilkington Brothers Plc | Coating apparatus |
US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
JPS61105853A (ja) * | 1984-10-30 | 1986-05-23 | Anelva Corp | オ−トロ−ダ− |
-
1987
- 1987-04-06 WO PCT/US1987/000799 patent/WO1987006561A1/en active IP Right Grant
- 1987-04-06 KR KR1019870701232A patent/KR950012969B1/ko not_active IP Right Cessation
- 1987-04-06 AT AT87903076T patent/ATE84276T1/de active
- 1987-04-06 EP EP87903076A patent/EP0267233B1/en not_active Expired - Lifetime
- 1987-04-06 JP JP62502482A patent/JP2639459B2/ja not_active Expired - Fee Related
- 1987-04-06 DE DE8787903076T patent/DE3783440T2/de not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100285408B1 (ko) * | 1996-09-26 | 2001-04-02 | 엔도 마코토 | 기판처리장치,기판반송기 및 기판반송장치 |
Also Published As
Publication number | Publication date |
---|---|
ATE84276T1 (de) | 1993-01-15 |
DE3783440T2 (de) | 1993-08-12 |
EP0267233A1 (en) | 1988-05-18 |
KR950012969B1 (ko) | 1995-10-24 |
JPS64500072A (ko) | 1989-01-12 |
DE3783440D1 (de) | 1993-02-18 |
JP2639459B2 (ja) | 1997-08-13 |
EP0267233B1 (en) | 1993-01-07 |
WO1987006561A1 (en) | 1987-11-05 |
EP0267233A4 (en) | 1988-07-27 |
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