DE3783440D1 - Modulare foerder- und beabeitungsanlage fuer halbleiterwafer. - Google Patents
Modulare foerder- und beabeitungsanlage fuer halbleiterwafer.Info
- Publication number
- DE3783440D1 DE3783440D1 DE8787903076T DE3783440T DE3783440D1 DE 3783440 D1 DE3783440 D1 DE 3783440D1 DE 8787903076 T DE8787903076 T DE 8787903076T DE 3783440 T DE3783440 T DE 3783440T DE 3783440 D1 DE3783440 D1 DE 3783440D1
- Authority
- DE
- Germany
- Prior art keywords
- processing system
- semiconductor wafer
- modular conveyor
- wafer
- modular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85673886A | 1986-04-28 | 1986-04-28 | |
PCT/US1987/000799 WO1987006561A1 (en) | 1986-04-28 | 1987-04-06 | Modular semiconductor wafer transport and processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3783440D1 true DE3783440D1 (de) | 1993-02-18 |
DE3783440T2 DE3783440T2 (de) | 1993-08-12 |
Family
ID=25324388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787903076T Expired - Fee Related DE3783440T2 (de) | 1986-04-28 | 1987-04-06 | Modulare foerder- und beabeitungsanlage fuer halbleiterwafer. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0267233B1 (de) |
JP (1) | JP2639459B2 (de) |
KR (1) | KR950012969B1 (de) |
AT (1) | ATE84276T1 (de) |
DE (1) | DE3783440T2 (de) |
WO (1) | WO1987006561A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308431A (en) * | 1986-04-18 | 1994-05-03 | General Signal Corporation | System providing multiple processing of substrates |
US5013385A (en) * | 1986-04-18 | 1991-05-07 | General Signal Corporation | Quad processor |
US5102495A (en) * | 1986-04-18 | 1992-04-07 | General Signal Corporation | Method providing multiple-processing of substrates |
US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
ATE102397T1 (de) * | 1986-12-19 | 1994-03-15 | Applied Materials Inc | Integriertes bearbeitungssystem mit vielfachkammer. |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
DE3702775A1 (de) * | 1987-01-30 | 1988-08-11 | Leybold Ag | Vorrichtung zum quasi-kontinuierlichen behandeln von substraten |
ATE208961T1 (de) * | 1988-05-24 | 2001-11-15 | Unaxis Balzers Ag | Vakuumanlage |
KR0152260B1 (ko) * | 1988-07-08 | 1998-12-15 | 고다까 토시오 | 프로우브 장치 |
DE68926480T2 (de) * | 1988-09-16 | 1996-10-02 | Texas Instruments Inc | Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung |
EP0371205B1 (de) * | 1988-11-30 | 1993-12-15 | International Business Machines Corporation | Beförderungsvorrichtung |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
US5032052A (en) * | 1989-12-27 | 1991-07-16 | Xerox Corporation | Modular apparatus for cleaning, coating and curing photoreceptors in a dual planetary array |
US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
USRE39824E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
US5248371A (en) * | 1992-08-13 | 1993-09-28 | General Signal Corporation | Hollow-anode glow discharge apparatus |
IL107549A (en) * | 1993-11-09 | 1996-01-31 | Nova Measuring Instr Ltd | Device for measuring the thickness of thin films |
US5764365A (en) | 1993-11-09 | 1998-06-09 | Nova Measuring Instruments, Ltd. | Two-dimensional beam deflector |
KR100269097B1 (ko) * | 1996-08-05 | 2000-12-01 | 엔도 마코토 | 기판처리장치 |
US5908281A (en) * | 1996-09-20 | 1999-06-01 | Brooks Automation Inc. | Coaxial drive loader arm |
JP3947761B2 (ja) * | 1996-09-26 | 2007-07-25 | 株式会社日立国際電気 | 基板処理装置、基板搬送機および基板処理方法 |
JP2000299367A (ja) | 1999-04-15 | 2000-10-24 | Tokyo Electron Ltd | 処理装置及び被処理体の搬送方法 |
US6918731B2 (en) | 2001-07-02 | 2005-07-19 | Brooks Automation, Incorporated | Fast swap dual substrate transport for load lock |
CN1640797A (zh) | 2003-11-13 | 2005-07-20 | 应用材料有限公司 | 具有剪切构件的动态销和使用该动态销的衬底载体 |
US7720558B2 (en) | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
US7611322B2 (en) | 2004-11-18 | 2009-11-03 | Intevac, Inc. | Processing thin wafers |
JP5316521B2 (ja) * | 2010-03-31 | 2013-10-16 | 株式会社安川電機 | 基板搬送システム、基板処理システムおよび基板搬送ロボット |
KR20150034143A (ko) * | 2012-07-04 | 2015-04-02 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
US9293355B2 (en) | 2012-11-09 | 2016-03-22 | Kabushiki Kaisha Yaskawa Denki | Substrate transfer system and substrate processing system |
CN105026115B (zh) * | 2013-01-18 | 2018-11-16 | 柿子技术公司 | 带有具有不等连接部长度的臂的机器人 |
US9149936B2 (en) | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
JP6665095B2 (ja) | 2013-08-26 | 2020-03-13 | ブルックス オートメーション インコーポレイテッド | 基板搬送装置 |
CN114367970B (zh) | 2015-03-12 | 2024-04-05 | 柿子技术公司 | 具有从动末端执行器运动的机器人 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3865254A (en) * | 1973-05-21 | 1975-02-11 | Kasker Instr Inc | Prealignment system for an optical alignment and exposure instrument |
US4208159A (en) * | 1977-07-18 | 1980-06-17 | Tokyo Ohka Kogyo Kabushiki Kaisha | Apparatus for the treatment of a wafer by plasma reaction |
JPS54159964A (en) * | 1978-06-06 | 1979-12-18 | Shiroyama Kogyo Kk | Articulated arm type manipulator |
US4405435A (en) * | 1980-08-27 | 1983-09-20 | Hitachi, Ltd. | Apparatus for performing continuous treatment in vacuum |
GB8332394D0 (en) * | 1983-12-05 | 1984-01-11 | Pilkington Brothers Plc | Coating apparatus |
US4584045A (en) * | 1984-02-21 | 1986-04-22 | Plasma-Therm, Inc. | Apparatus for conveying a semiconductor wafer |
JPS61105853A (ja) * | 1984-10-30 | 1986-05-23 | Anelva Corp | オ−トロ−ダ− |
-
1987
- 1987-04-06 DE DE8787903076T patent/DE3783440T2/de not_active Expired - Fee Related
- 1987-04-06 EP EP87903076A patent/EP0267233B1/de not_active Expired - Lifetime
- 1987-04-06 AT AT87903076T patent/ATE84276T1/de active
- 1987-04-06 JP JP62502482A patent/JP2639459B2/ja not_active Expired - Fee Related
- 1987-04-06 KR KR1019870701232A patent/KR950012969B1/ko not_active IP Right Cessation
- 1987-04-06 WO PCT/US1987/000799 patent/WO1987006561A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0267233A1 (de) | 1988-05-18 |
JP2639459B2 (ja) | 1997-08-13 |
EP0267233B1 (de) | 1993-01-07 |
JPS64500072A (de) | 1989-01-12 |
DE3783440T2 (de) | 1993-08-12 |
ATE84276T1 (de) | 1993-01-15 |
KR880701205A (ko) | 1988-07-26 |
WO1987006561A1 (en) | 1987-11-05 |
KR950012969B1 (ko) | 1995-10-24 |
EP0267233A4 (de) | 1988-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N. |
|
8339 | Ceased/non-payment of the annual fee |