DE3783440T2 - Modulare foerder- und beabeitungsanlage fuer halbleiterwafer. - Google Patents

Modulare foerder- und beabeitungsanlage fuer halbleiterwafer.

Info

Publication number
DE3783440T2
DE3783440T2 DE8787903076T DE3783440T DE3783440T2 DE 3783440 T2 DE3783440 T2 DE 3783440T2 DE 8787903076 T DE8787903076 T DE 8787903076T DE 3783440 T DE3783440 T DE 3783440T DE 3783440 T2 DE3783440 T2 DE 3783440T2
Authority
DE
Germany
Prior art keywords
processing system
semiconductor wafer
modular conveyor
wafer
modular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787903076T
Other languages
English (en)
Other versions
DE3783440D1 (de
Inventor
R Stark
Frederick Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of DE3783440D1 publication Critical patent/DE3783440D1/de
Application granted granted Critical
Publication of DE3783440T2 publication Critical patent/DE3783440T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
DE8787903076T 1986-04-28 1987-04-06 Modulare foerder- und beabeitungsanlage fuer halbleiterwafer. Expired - Fee Related DE3783440T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85673886A 1986-04-28 1986-04-28
PCT/US1987/000799 WO1987006561A1 (en) 1986-04-28 1987-04-06 Modular semiconductor wafer transport and processing system

Publications (2)

Publication Number Publication Date
DE3783440D1 DE3783440D1 (de) 1993-02-18
DE3783440T2 true DE3783440T2 (de) 1993-08-12

Family

ID=25324388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787903076T Expired - Fee Related DE3783440T2 (de) 1986-04-28 1987-04-06 Modulare foerder- und beabeitungsanlage fuer halbleiterwafer.

Country Status (6)

Country Link
EP (1) EP0267233B1 (de)
JP (1) JP2639459B2 (de)
KR (1) KR950012969B1 (de)
AT (1) ATE84276T1 (de)
DE (1) DE3783440T2 (de)
WO (1) WO1987006561A1 (de)

Families Citing this family (36)

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US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
ATE102397T1 (de) * 1986-12-19 1994-03-15 Applied Materials Inc Integriertes bearbeitungssystem mit vielfachkammer.
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
ATE208961T1 (de) * 1988-05-24 2001-11-15 Unaxis Balzers Ag Vakuumanlage
KR0152260B1 (ko) * 1988-07-08 1998-12-15 고다까 토시오 프로우브 장치
EP0359221B1 (de) * 1988-09-16 1996-05-15 Texas Instruments Incorporated Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung
DE68911490T2 (de) * 1988-11-30 1994-06-23 Ibm Beförderungsvorrichtung.
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5032052A (en) * 1989-12-27 1991-07-16 Xerox Corporation Modular apparatus for cleaning, coating and curing photoreceptors in a dual planetary array
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39824E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
JP2751975B2 (ja) * 1991-12-20 1998-05-18 株式会社日立製作所 半導体処理装置のロードロック室
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US5764365A (en) 1993-11-09 1998-06-09 Nova Measuring Instruments, Ltd. Two-dimensional beam deflector
IL107549A (en) * 1993-11-09 1996-01-31 Nova Measuring Instr Ltd Device for measuring the thickness of thin films
KR100269097B1 (ko) * 1996-08-05 2000-12-01 엔도 마코토 기판처리장치
US5908281A (en) * 1996-09-20 1999-06-01 Brooks Automation Inc. Coaxial drive loader arm
JP3947761B2 (ja) * 1996-09-26 2007-07-25 株式会社日立国際電気 基板処理装置、基板搬送機および基板処理方法
JP2000299367A (ja) 1999-04-15 2000-10-24 Tokyo Electron Ltd 処理装置及び被処理体の搬送方法
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US20050167554A1 (en) 2003-11-13 2005-08-04 Rice Michael R. Kinematic pin with shear member and substrate carrier for use therewith
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US7611322B2 (en) 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
JP5316521B2 (ja) * 2010-03-31 2013-10-16 株式会社安川電機 基板搬送システム、基板処理システムおよび基板搬送ロボット
KR101888000B1 (ko) 2012-07-04 2018-08-13 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US9293355B2 (en) 2012-11-09 2016-03-22 Kabushiki Kaisha Yaskawa Denki Substrate transfer system and substrate processing system
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
KR102214943B1 (ko) * 2013-01-18 2021-02-10 퍼시몬 테크놀로지스 코포레이션 상이한 링크 길이를 가지는 아암이 구비되는 로봇
KR102285254B1 (ko) 2013-08-26 2021-08-03 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
JP7074977B2 (ja) 2015-03-12 2022-05-25 パーシモン テクノロジーズ コーポレイション エンドエフェクタの従動運動を伴うロボット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865254A (en) * 1973-05-21 1975-02-11 Kasker Instr Inc Prealignment system for an optical alignment and exposure instrument
US4208159A (en) * 1977-07-18 1980-06-17 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of a wafer by plasma reaction
JPS54159964A (en) * 1978-06-06 1979-12-18 Shiroyama Kogyo Kk Articulated arm type manipulator
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−

Also Published As

Publication number Publication date
WO1987006561A1 (en) 1987-11-05
EP0267233A4 (de) 1988-07-27
EP0267233A1 (de) 1988-05-18
KR880701205A (ko) 1988-07-26
JPS64500072A (de) 1989-01-12
DE3783440D1 (de) 1993-02-18
ATE84276T1 (de) 1993-01-15
JP2639459B2 (ja) 1997-08-13
EP0267233B1 (de) 1993-01-07
KR950012969B1 (ko) 1995-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee