KR100236626B1 - 금속막을 선택적으로 피착하는 방법 - Google Patents

금속막을 선택적으로 피착하는 방법 Download PDF

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Publication number
KR100236626B1
KR100236626B1 KR1019960027354A KR19960027354A KR100236626B1 KR 100236626 B1 KR100236626 B1 KR 100236626B1 KR 1019960027354 A KR1019960027354 A KR 1019960027354A KR 19960027354 A KR19960027354 A KR 19960027354A KR 100236626 B1 KR100236626 B1 KR 100236626B1
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KR
South Korea
Prior art keywords
substrate
vacuum chamber
gas
film
layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1019960027354A
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English (en)
Korean (ko)
Inventor
히또시 이또
Original Assignee
니시무로 타이죠
가부시키가이샤 도시바
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Publication of KR100236626B1 publication Critical patent/KR100236626B1/ko
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Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H10P14/43—Chemical deposition, e.g. chemical vapour deposition [CVD]
    • H10P14/432—Chemical deposition, e.g. chemical vapour deposition [CVD] using selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
KR1019960027354A 1995-07-07 1996-07-06 금속막을 선택적으로 피착하는 방법 Expired - Fee Related KR100236626B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7172480A JPH0922896A (ja) 1995-07-07 1995-07-07 金属膜の選択的形成方法
JP95-172480 1995-07-07

Publications (1)

Publication Number Publication Date
KR100236626B1 true KR100236626B1 (ko) 2000-01-15

Family

ID=15942777

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960027354A Expired - Fee Related KR100236626B1 (ko) 1995-07-07 1996-07-06 금속막을 선택적으로 피착하는 방법

Country Status (5)

Country Link
US (1) US6013575A (enExample)
JP (1) JPH0922896A (enExample)
KR (1) KR100236626B1 (enExample)
DE (1) DE19627017A1 (enExample)
TW (1) TW300325B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210092113A (ko) * 2020-01-15 2021-07-23 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체

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KR102828798B1 (ko) 2018-12-05 2025-07-02 램 리써치 코포레이션 보이드 프리 (void free) 저응력 (low stress) 충진
JP7649741B2 (ja) 2018-12-14 2025-03-21 ラム リサーチ コーポレーション ３ｄ ｎａｎｄ構造上の原子層堆積
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20210092113A (ko) * 2020-01-15 2021-07-23 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체
KR102337523B1 (ko) 2020-01-15 2021-12-08 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체

Also Published As

Publication number Publication date
JPH0922896A (ja) 1997-01-21
US6013575A (en) 2000-01-11
DE19627017A1 (de) 1997-01-09
TW300325B (enExample) 1997-03-11

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