JPWO2024029235A5 - - Google Patents
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- Publication number
- JPWO2024029235A5 JPWO2024029235A5 JP2024538857A JP2024538857A JPWO2024029235A5 JP WO2024029235 A5 JPWO2024029235 A5 JP WO2024029235A5 JP 2024538857 A JP2024538857 A JP 2024538857A JP 2024538857 A JP2024538857 A JP 2024538857A JP WO2024029235 A5 JPWO2024029235 A5 JP WO2024029235A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- thickness direction
- lead
- resin surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 26
- 229920005989 resin Polymers 0.000 claims 26
- 239000004065 semiconductor Substances 0.000 claims 19
- 238000007789 sealing Methods 0.000 claims 5
- 239000000945 filler Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 3
- 230000003746 surface roughness Effects 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022122797 | 2022-08-01 | ||
| PCT/JP2023/023839 WO2024029235A1 (ja) | 2022-08-01 | 2023-06-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029235A1 JPWO2024029235A1 (https=) | 2024-02-08 |
| JPWO2024029235A5 true JPWO2024029235A5 (https=) | 2025-04-11 |
Family
ID=89848868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538857A Pending JPWO2024029235A1 (https=) | 2022-08-01 | 2023-06-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029235A1 (https=) |
| WO (1) | WO2024029235A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2911265B2 (ja) * | 1991-09-27 | 1999-06-23 | 三洋電機株式会社 | 表面実装型半導体装置 |
| JP2006203048A (ja) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP4737138B2 (ja) * | 2007-05-14 | 2011-07-27 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| TWI525767B (zh) * | 2011-04-04 | 2016-03-11 | 羅姆電子股份有限公司 | Semiconductor device and method for manufacturing semiconductor device |
| JP5976557B2 (ja) * | 2013-01-22 | 2016-08-23 | 新電元工業株式会社 | モールド金型、該モールド金型を用いた樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置 |
| WO2020059751A1 (ja) * | 2018-09-19 | 2020-03-26 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-06-27 WO PCT/JP2023/023839 patent/WO2024029235A1/ja not_active Ceased
- 2023-06-27 JP JP2024538857A patent/JPWO2024029235A1/ja active Pending
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