JPWO2024029235A1 - - Google Patents
Info
- Publication number
- JPWO2024029235A1 JPWO2024029235A1 JP2024538857A JP2024538857A JPWO2024029235A1 JP WO2024029235 A1 JPWO2024029235 A1 JP WO2024029235A1 JP 2024538857 A JP2024538857 A JP 2024538857A JP 2024538857 A JP2024538857 A JP 2024538857A JP WO2024029235 A1 JPWO2024029235 A1 JP WO2024029235A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022122797 | 2022-08-01 | ||
| PCT/JP2023/023839 WO2024029235A1 (ja) | 2022-08-01 | 2023-06-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029235A1 true JPWO2024029235A1 (https=) | 2024-02-08 |
| JPWO2024029235A5 JPWO2024029235A5 (https=) | 2025-04-11 |
Family
ID=89848868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538857A Pending JPWO2024029235A1 (https=) | 2022-08-01 | 2023-06-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029235A1 (https=) |
| WO (1) | WO2024029235A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2911265B2 (ja) * | 1991-09-27 | 1999-06-23 | 三洋電機株式会社 | 表面実装型半導体装置 |
| JP2006203048A (ja) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP4737138B2 (ja) * | 2007-05-14 | 2011-07-27 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| US9093434B2 (en) * | 2011-04-04 | 2015-07-28 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP5976557B2 (ja) * | 2013-01-22 | 2016-08-23 | 新電元工業株式会社 | モールド金型、該モールド金型を用いた樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置 |
| US11502014B2 (en) * | 2018-09-19 | 2022-11-15 | Rohm Co., Ltd. | Semiconductor device |
-
2023
- 2023-06-27 WO PCT/JP2023/023839 patent/WO2024029235A1/ja not_active Ceased
- 2023-06-27 JP JP2024538857A patent/JPWO2024029235A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024029235A1 (ja) | 2024-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250110 |