JPWO2023248670A5 - - Google Patents

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Publication number
JPWO2023248670A5
JPWO2023248670A5 JP2024528425A JP2024528425A JPWO2023248670A5 JP WO2023248670 A5 JPWO2023248670 A5 JP WO2023248670A5 JP 2024528425 A JP2024528425 A JP 2024528425A JP 2024528425 A JP2024528425 A JP 2024528425A JP WO2023248670 A5 JPWO2023248670 A5 JP WO2023248670A5
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JP
Japan
Prior art keywords
insulating film
semiconductor device
electrode layer
arithmetic mean
mean roughness
Prior art date
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Application number
JP2024528425A
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English (en)
Japanese (ja)
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JP7789208B2 (ja
JPWO2023248670A1 (https=
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Priority claimed from PCT/JP2023/018941 external-priority patent/WO2023248670A1/ja
Publication of JPWO2023248670A1 publication Critical patent/JPWO2023248670A1/ja
Publication of JPWO2023248670A5 publication Critical patent/JPWO2023248670A5/ja
Application granted granted Critical
Publication of JP7789208B2 publication Critical patent/JP7789208B2/ja
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JP2024528425A 2022-06-22 2023-05-22 半導体装置、電力変換装置、および、半導体装置の製造方法 Active JP7789208B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022100048 2022-06-22
JP2022100048 2022-06-22
PCT/JP2023/018941 WO2023248670A1 (ja) 2022-06-22 2023-05-22 半導体装置、電力変換装置、および、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023248670A1 JPWO2023248670A1 (https=) 2023-12-28
JPWO2023248670A5 true JPWO2023248670A5 (https=) 2024-09-13
JP7789208B2 JP7789208B2 (ja) 2025-12-19

Family

ID=89379721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528425A Active JP7789208B2 (ja) 2022-06-22 2023-05-22 半導体装置、電力変換装置、および、半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20250273527A1 (https=)
JP (1) JP7789208B2 (https=)
CN (1) CN119384877A (https=)
DE (1) DE112023002719T5 (https=)
WO (1) WO2023248670A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048639A (ja) * 2002-05-17 2004-02-12 Murata Mfg Co Ltd 圧電共振子及びその製造方法等
JP5017805B2 (ja) * 2005-06-17 2012-09-05 凸版印刷株式会社 マイクロ反応チップの製造方法
JP6855804B2 (ja) * 2017-01-17 2021-04-07 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2021033664A1 (ja) * 2019-08-21 2021-02-25 株式会社村田製作所 半導体装置

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