JPWO2023189164A5 - - Google Patents

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Publication number
JPWO2023189164A5
JPWO2023189164A5 JP2024511538A JP2024511538A JPWO2023189164A5 JP WO2023189164 A5 JPWO2023189164 A5 JP WO2023189164A5 JP 2024511538 A JP2024511538 A JP 2024511538A JP 2024511538 A JP2024511538 A JP 2024511538A JP WO2023189164 A5 JPWO2023189164 A5 JP WO2023189164A5
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JP
Japan
Prior art keywords
semiconductor device
semiconductor substrate
electrode
reference surface
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2024511538A
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English (en)
Japanese (ja)
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JPWO2023189164A1 (https=
JP7785159B2 (ja
Publication date
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Priority claimed from PCT/JP2023/007772 external-priority patent/WO2023189164A1/ja
Publication of JPWO2023189164A1 publication Critical patent/JPWO2023189164A1/ja
Publication of JPWO2023189164A5 publication Critical patent/JPWO2023189164A5/ja
Application granted granted Critical
Publication of JP7785159B2 publication Critical patent/JP7785159B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024511538A 2022-03-30 2023-03-02 半導体装置及び電力変換装置 Active JP7785159B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022056620 2022-03-30
JP2022056620 2022-03-30
PCT/JP2023/007772 WO2023189164A1 (ja) 2022-03-30 2023-03-02 半導体装置及び電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2023189164A1 JPWO2023189164A1 (https=) 2023-10-05
JPWO2023189164A5 true JPWO2023189164A5 (https=) 2024-07-01
JP7785159B2 JP7785159B2 (ja) 2025-12-12

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ID=88201193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511538A Active JP7785159B2 (ja) 2022-03-30 2023-03-02 半導体装置及び電力変換装置

Country Status (4)

Country Link
US (1) US20250113533A1 (https=)
JP (1) JP7785159B2 (https=)
CN (1) CN118901141A (https=)
WO (1) WO2023189164A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757733B2 (ja) * 1992-03-25 1998-05-25 松下電器産業株式会社 半導体装置の製造方法
JP2010171057A (ja) * 2009-01-20 2010-08-05 Denso Corp 半導体装置およびその製造方法
WO2016114057A1 (ja) * 2015-01-16 2016-07-21 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
CN111819696B (zh) * 2018-03-07 2024-03-29 三菱电机株式会社 碳化硅半导体装置、电力变换装置和碳化硅半导体装置的制造方法

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