JPWO2024004026A5 - - Google Patents

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Publication number
JPWO2024004026A5
JPWO2024004026A5 JP2023560654A JP2023560654A JPWO2024004026A5 JP WO2024004026 A5 JPWO2024004026 A5 JP WO2024004026A5 JP 2023560654 A JP2023560654 A JP 2023560654A JP 2023560654 A JP2023560654 A JP 2023560654A JP WO2024004026 A5 JPWO2024004026 A5 JP WO2024004026A5
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JP
Japan
Prior art keywords
semiconductor device
sealing member
heat spreader
cooler
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023560654A
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English (en)
Japanese (ja)
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JPWO2024004026A1 (https=
JP7493686B1 (ja
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Publication date
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Priority claimed from PCT/JP2022/025735 external-priority patent/WO2024004026A1/ja
Publication of JPWO2024004026A1 publication Critical patent/JPWO2024004026A1/ja
Application granted granted Critical
Publication of JP7493686B1 publication Critical patent/JP7493686B1/ja
Publication of JPWO2024004026A5 publication Critical patent/JPWO2024004026A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023560654A 2022-06-28 2022-06-28 半導体装置及び電力変換装置 Active JP7493686B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025735 WO2024004026A1 (ja) 2022-06-28 2022-06-28 半導体装置及び電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2024004026A1 JPWO2024004026A1 (https=) 2024-01-04
JP7493686B1 JP7493686B1 (ja) 2024-05-31
JPWO2024004026A5 true JPWO2024004026A5 (https=) 2024-06-04

Family

ID=89382139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023560654A Active JP7493686B1 (ja) 2022-06-28 2022-06-28 半導体装置及び電力変換装置

Country Status (5)

Country Link
US (1) US20250364368A1 (https=)
JP (1) JP7493686B1 (https=)
CN (1) CN119365978A (https=)
DE (1) DE112022007435T5 (https=)
WO (1) WO2024004026A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240321698A1 (en) * 2023-03-23 2024-09-26 Toyota Motor Engineering & Manufacturing North America, Inc. Chip-on-chip power card having immersion cooling
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2718136B2 (ja) * 1989-01-31 1998-02-25 日本電気株式会社 樹脂封止型半導体装置
JPH0427147A (ja) * 1990-05-22 1992-01-30 Seiko Epson Corp 半導体装置
JPH04254359A (ja) * 1991-02-06 1992-09-09 Toshiba Corp 樹脂封止型半導体装置および半導体装置の実装構造
US7205653B2 (en) * 2004-08-17 2007-04-17 Delphi Technologies, Inc. Fluid cooled encapsulated microelectronic package
JP2012079950A (ja) * 2010-10-04 2012-04-19 Toyota Motor Corp 半導体冷却装置
JP2012164697A (ja) * 2011-02-03 2012-08-30 Mitsubishi Electric Corp 電力用パワーモジュール及び電力用半導体装置
JP2020053611A (ja) * 2018-09-28 2020-04-02 三菱電機株式会社 半導体モジュール、および、半導体モジュールの製造方法

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