JPWO2024004026A1 - - Google Patents
Info
- Publication number
- JPWO2024004026A1 JPWO2024004026A1 JP2023560654A JP2023560654A JPWO2024004026A1 JP WO2024004026 A1 JPWO2024004026 A1 JP WO2024004026A1 JP 2023560654 A JP2023560654 A JP 2023560654A JP 2023560654 A JP2023560654 A JP 2023560654A JP WO2024004026 A1 JPWO2024004026 A1 JP WO2024004026A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/865—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/025735 WO2024004026A1 (ja) | 2022-06-28 | 2022-06-28 | 半導体装置及び電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004026A1 true JPWO2024004026A1 (https=) | 2024-01-04 |
| JP7493686B1 JP7493686B1 (ja) | 2024-05-31 |
| JPWO2024004026A5 JPWO2024004026A5 (https=) | 2024-06-04 |
Family
ID=89382139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023560654A Active JP7493686B1 (ja) | 2022-06-28 | 2022-06-28 | 半導体装置及び電力変換装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250364368A1 (https=) |
| JP (1) | JP7493686B1 (https=) |
| CN (1) | CN119365978A (https=) |
| DE (1) | DE112022007435T5 (https=) |
| WO (1) | WO2024004026A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240321698A1 (en) * | 2023-03-23 | 2024-09-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Chip-on-chip power card having immersion cooling |
| WO2025243727A1 (ja) * | 2024-05-22 | 2025-11-27 | 三菱電機株式会社 | 電力半導体装置、及び、電力変換装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2718136B2 (ja) * | 1989-01-31 | 1998-02-25 | 日本電気株式会社 | 樹脂封止型半導体装置 |
| JPH0427147A (ja) * | 1990-05-22 | 1992-01-30 | Seiko Epson Corp | 半導体装置 |
| JPH04254359A (ja) * | 1991-02-06 | 1992-09-09 | Toshiba Corp | 樹脂封止型半導体装置および半導体装置の実装構造 |
| US7205653B2 (en) * | 2004-08-17 | 2007-04-17 | Delphi Technologies, Inc. | Fluid cooled encapsulated microelectronic package |
| JP2012079950A (ja) * | 2010-10-04 | 2012-04-19 | Toyota Motor Corp | 半導体冷却装置 |
| JP2012164697A (ja) * | 2011-02-03 | 2012-08-30 | Mitsubishi Electric Corp | 電力用パワーモジュール及び電力用半導体装置 |
| JP2020053611A (ja) * | 2018-09-28 | 2020-04-02 | 三菱電機株式会社 | 半導体モジュール、および、半導体モジュールの製造方法 |
-
2022
- 2022-06-28 JP JP2023560654A patent/JP7493686B1/ja active Active
- 2022-06-28 WO PCT/JP2022/025735 patent/WO2024004026A1/ja not_active Ceased
- 2022-06-28 CN CN202280097137.6A patent/CN119365978A/zh active Pending
- 2022-06-28 US US18/867,811 patent/US20250364368A1/en active Pending
- 2022-06-28 DE DE112022007435.3T patent/DE112022007435T5/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP7493686B1 (ja) | 2024-05-31 |
| WO2024004026A1 (ja) | 2024-01-04 |
| DE112022007435T5 (de) | 2025-04-10 |
| US20250364368A1 (en) | 2025-11-27 |
| CN119365978A (zh) | 2025-01-24 |
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