JPWO2025022671A1 - - Google Patents
Info
- Publication number
- JPWO2025022671A1 JPWO2025022671A1 JP2023577463A JP2023577463A JPWO2025022671A1 JP WO2025022671 A1 JPWO2025022671 A1 JP WO2025022671A1 JP 2023577463 A JP2023577463 A JP 2023577463A JP 2023577463 A JP2023577463 A JP 2023577463A JP WO2025022671 A1 JPWO2025022671 A1 JP WO2025022671A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/027643 WO2025022671A1 (ja) | 2023-07-27 | 2023-07-27 | 電力半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7479580B1 JP7479580B1 (ja) | 2024-05-08 |
| JPWO2025022671A1 true JPWO2025022671A1 (https=) | 2025-01-30 |
| JPWO2025022671A5 JPWO2025022671A5 (https=) | 2025-07-01 |
Family
ID=90926143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023577463A Active JP7479580B1 (ja) | 2023-07-27 | 2023-07-27 | 電力半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260113911A1 (https=) |
| JP (1) | JP7479580B1 (https=) |
| CN (1) | CN121400138A (https=) |
| WO (1) | WO2025022671A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025243727A1 (ja) * | 2024-05-22 | 2025-11-27 | 三菱電機株式会社 | 電力半導体装置、及び、電力変換装置 |
| KR20260009027A (ko) | 2024-07-10 | 2026-01-19 | 엘에스일렉트릭(주) | 히트 싱크 구조체 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5155590B2 (ja) * | 2007-04-13 | 2013-03-06 | 日本インター株式会社 | 冷却装置 |
| JP5440061B2 (ja) * | 2009-09-16 | 2014-03-12 | 富士電機株式会社 | 空冷式パワー半導体装置 |
| CN104145333B (zh) * | 2012-04-16 | 2018-02-02 | 富士电机株式会社 | 半导体装置以及半导体装置用冷却器 |
| US20240274489A1 (en) * | 2021-06-18 | 2024-08-15 | Mitsubishi Electric Corporation | Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion Device |
| CN119604980B (zh) * | 2022-10-13 | 2026-01-16 | 三菱电机株式会社 | 电力半导体装置及电力半导体装置的制造方法 |
-
2023
- 2023-07-27 CN CN202380099901.8A patent/CN121400138A/zh active Pending
- 2023-07-27 US US19/486,045 patent/US20260113911A1/en active Pending
- 2023-07-27 JP JP2023577463A patent/JP7479580B1/ja active Active
- 2023-07-27 WO PCT/JP2023/027643 patent/WO2025022671A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN121400138A (zh) | 2026-01-23 |
| JP7479580B1 (ja) | 2024-05-08 |
| US20260113911A1 (en) | 2026-04-23 |
| WO2025022671A1 (ja) | 2025-01-30 |
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