JPWO2025022671A5 - - Google Patents

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Publication number
JPWO2025022671A5
JPWO2025022671A5 JP2023577463A JP2023577463A JPWO2025022671A5 JP WO2025022671 A5 JPWO2025022671 A5 JP WO2025022671A5 JP 2023577463 A JP2023577463 A JP 2023577463A JP 2023577463 A JP2023577463 A JP 2023577463A JP WO2025022671 A5 JPWO2025022671 A5 JP WO2025022671A5
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JP
Japan
Prior art keywords
semiconductor device
heat sink
power semiconductor
air flow
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023577463A
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English (en)
Japanese (ja)
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JP7479580B1 (ja
JPWO2025022671A1 (https=
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Priority claimed from PCT/JP2023/027643 external-priority patent/WO2025022671A1/ja
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Publication of JP7479580B1 publication Critical patent/JP7479580B1/ja
Publication of JPWO2025022671A1 publication Critical patent/JPWO2025022671A1/ja
Publication of JPWO2025022671A5 publication Critical patent/JPWO2025022671A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023577463A 2023-07-27 2023-07-27 電力半導体装置 Active JP7479580B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/027643 WO2025022671A1 (ja) 2023-07-27 2023-07-27 電力半導体装置

Publications (3)

Publication Number Publication Date
JP7479580B1 JP7479580B1 (ja) 2024-05-08
JPWO2025022671A1 JPWO2025022671A1 (https=) 2025-01-30
JPWO2025022671A5 true JPWO2025022671A5 (https=) 2025-07-01

Family

ID=90926143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023577463A Active JP7479580B1 (ja) 2023-07-27 2023-07-27 電力半導体装置

Country Status (4)

Country Link
US (1) US20260113911A1 (https=)
JP (1) JP7479580B1 (https=)
CN (1) CN121400138A (https=)
WO (1) WO2025022671A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置
KR20260009027A (ko) 2024-07-10 2026-01-19 엘에스일렉트릭(주) 히트 싱크 구조체

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5155590B2 (ja) * 2007-04-13 2013-03-06 日本インター株式会社 冷却装置
JP5440061B2 (ja) * 2009-09-16 2014-03-12 富士電機株式会社 空冷式パワー半導体装置
CN104145333B (zh) * 2012-04-16 2018-02-02 富士电机株式会社 半导体装置以及半导体装置用冷却器
US20240274489A1 (en) * 2021-06-18 2024-08-15 Mitsubishi Electric Corporation Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion Device
CN119604980B (zh) * 2022-10-13 2026-01-16 三菱电机株式会社 电力半导体装置及电力半导体装置的制造方法

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