JP7479580B1 - 電力半導体装置 - Google Patents

電力半導体装置 Download PDF

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Publication number
JP7479580B1
JP7479580B1 JP2023577463A JP2023577463A JP7479580B1 JP 7479580 B1 JP7479580 B1 JP 7479580B1 JP 2023577463 A JP2023577463 A JP 2023577463A JP 2023577463 A JP2023577463 A JP 2023577463A JP 7479580 B1 JP7479580 B1 JP 7479580B1
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JP
Japan
Prior art keywords
heat sink
semiconductor device
power semiconductor
air flow
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023577463A
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English (en)
Japanese (ja)
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JPWO2025022671A1 (https=
JPWO2025022671A5 (https=
Inventor
達志 森貞
泰之 三田
建一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
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Publication of JP7479580B1 publication Critical patent/JP7479580B1/ja
Publication of JPWO2025022671A1 publication Critical patent/JPWO2025022671A1/ja
Publication of JPWO2025022671A5 publication Critical patent/JPWO2025022671A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023577463A 2023-07-27 2023-07-27 電力半導体装置 Active JP7479580B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/027643 WO2025022671A1 (ja) 2023-07-27 2023-07-27 電力半導体装置

Publications (3)

Publication Number Publication Date
JP7479580B1 true JP7479580B1 (ja) 2024-05-08
JPWO2025022671A1 JPWO2025022671A1 (https=) 2025-01-30
JPWO2025022671A5 JPWO2025022671A5 (https=) 2025-07-01

Family

ID=90926143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023577463A Active JP7479580B1 (ja) 2023-07-27 2023-07-27 電力半導体装置

Country Status (4)

Country Link
US (1) US20260113911A1 (https=)
JP (1) JP7479580B1 (https=)
CN (1) CN121400138A (https=)
WO (1) WO2025022671A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置
KR20260009027A (ko) 2024-07-10 2026-01-19 엘에스일렉트릭(주) 히트 싱크 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263137A (ja) * 2007-04-13 2008-10-30 Nippon Inter Electronics Corp 冷却装置
JP2011066123A (ja) * 2009-09-16 2011-03-31 Fuji Electric Systems Co Ltd 空冷式パワー半導体装置
WO2013157467A1 (ja) * 2012-04-16 2013-10-24 富士電機株式会社 半導体装置および半導体装置用冷却器
WO2022265003A1 (ja) * 2021-06-18 2022-12-22 三菱電機株式会社 パワー半導体装置およびその製造方法ならびに電力変換装置
JP7258269B1 (ja) * 2022-10-13 2023-04-14 三菱電機株式会社 電力半導体装置および電力半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263137A (ja) * 2007-04-13 2008-10-30 Nippon Inter Electronics Corp 冷却装置
JP2011066123A (ja) * 2009-09-16 2011-03-31 Fuji Electric Systems Co Ltd 空冷式パワー半導体装置
WO2013157467A1 (ja) * 2012-04-16 2013-10-24 富士電機株式会社 半導体装置および半導体装置用冷却器
WO2022265003A1 (ja) * 2021-06-18 2022-12-22 三菱電機株式会社 パワー半導体装置およびその製造方法ならびに電力変換装置
JP7258269B1 (ja) * 2022-10-13 2023-04-14 三菱電機株式会社 電力半導体装置および電力半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置
KR20260009027A (ko) 2024-07-10 2026-01-19 엘에스일렉트릭(주) 히트 싱크 구조체

Also Published As

Publication number Publication date
CN121400138A (zh) 2026-01-23
US20260113911A1 (en) 2026-04-23
JPWO2025022671A1 (https=) 2025-01-30
WO2025022671A1 (ja) 2025-01-30

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