JPWO2024079846A1 - - Google Patents

Info

Publication number
JPWO2024079846A1
JPWO2024079846A1 JP2023509445A JP2023509445A JPWO2024079846A1 JP WO2024079846 A1 JPWO2024079846 A1 JP WO2024079846A1 JP 2023509445 A JP2023509445 A JP 2023509445A JP 2023509445 A JP2023509445 A JP 2023509445A JP WO2024079846 A1 JPWO2024079846 A1 JP WO2024079846A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023509445A
Other languages
Japanese (ja)
Other versions
JP7258269B1 (ja
JPWO2024079846A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7258269B1 publication Critical patent/JP7258269B1/ja
Publication of JPWO2024079846A1 publication Critical patent/JPWO2024079846A1/ja
Publication of JPWO2024079846A5 publication Critical patent/JPWO2024079846A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023509445A 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法 Active JP7258269B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038210 WO2024079846A1 (ja) 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP7258269B1 JP7258269B1 (ja) 2023-04-14
JPWO2024079846A1 true JPWO2024079846A1 (https=) 2024-04-18
JPWO2024079846A5 JPWO2024079846A5 (https=) 2024-09-11

Family

ID=85980405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509445A Active JP7258269B1 (ja) 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法

Country Status (4)

Country Link
US (1) US20250167073A1 (https=)
JP (1) JP7258269B1 (https=)
CN (1) CN119604980B (https=)
WO (1) WO2024079846A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121400138A (zh) * 2023-07-27 2026-01-23 三菱电机株式会社 电力半导体装置
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835524A1 (de) * 1996-01-04 1998-04-15 Daimler-Benz Aktiengesellschaft Kühlkörper mit zapfen
JP2001035981A (ja) * 1999-07-16 2001-02-09 Toshiba Corp 半導体素子用冷却器及びこれを用いた電力変換装置
US6414867B2 (en) * 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
WO2007032056A1 (ja) * 2005-09-13 2007-03-22 Mitsubishi Denki Kabushiki Kaisha ヒートシンク
TWM300577U (en) * 2006-05-25 2006-11-11 Cooler Master Co Ltd Perforation spreading jig of heat-dissipating fin
JP5084527B2 (ja) * 2008-01-23 2012-11-28 三菱電機株式会社 ヒートシンクおよび電気機器
JP5314933B2 (ja) * 2008-06-02 2013-10-16 本田技研工業株式会社 電力変換装置
JP5089662B2 (ja) * 2009-08-04 2012-12-05 三菱電機株式会社 半導体モジュール
EP2465138B1 (en) * 2009-08-10 2016-11-23 Fuji Electric Co., Ltd. Semiconductor module and cooling unit
JP2011155207A (ja) * 2010-01-28 2011-08-11 Aisin Aw Co Ltd インバータモジュールの製造方法及びインバータモジュール
KR101533895B1 (ko) * 2010-09-02 2015-07-03 도요타지도샤가부시키가이샤 반도체 모듈
CN101975376B (zh) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 背光模块的发光源散热构造
JPWO2012157247A1 (ja) * 2011-05-16 2014-07-31 富士電機株式会社 半導体モジュール用冷却器
US20130027885A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Heat spreader for multi-chip modules
JP5716610B2 (ja) * 2011-08-30 2015-05-13 株式会社デンソー 電力変換装置
JP2013074721A (ja) * 2011-09-28 2013-04-22 Denso Corp 電力変換装置
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
JP2012199596A (ja) * 2012-07-25 2012-10-18 Mitsubishi Electric Corp 半導体モジュール
JP5787105B2 (ja) * 2013-05-07 2015-09-30 株式会社安川電機 電力変換装置
JP6227970B2 (ja) * 2013-10-16 2017-11-08 本田技研工業株式会社 半導体装置
JP6318857B2 (ja) * 2014-05-27 2018-05-09 富士通株式会社 ヒートシンク及び基板ユニット
JP6789335B2 (ja) * 2019-03-05 2020-11-25 三菱電機株式会社 ヒートシンク及びこれを備えた半導体モジュール

Also Published As

Publication number Publication date
CN119604980B (zh) 2026-01-16
CN119604980A (zh) 2025-03-11
JP7258269B1 (ja) 2023-04-14
WO2024079846A1 (ja) 2024-04-18
US20250167073A1 (en) 2025-05-22

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