CN119604980B - 电力半导体装置及电力半导体装置的制造方法 - Google Patents

电力半导体装置及电力半导体装置的制造方法

Info

Publication number
CN119604980B
CN119604980B CN202280097747.6A CN202280097747A CN119604980B CN 119604980 B CN119604980 B CN 119604980B CN 202280097747 A CN202280097747 A CN 202280097747A CN 119604980 B CN119604980 B CN 119604980B
Authority
CN
China
Prior art keywords
radiator
semiconductor device
heat sink
power module
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280097747.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN119604980A (zh
Inventor
三田泰之
森贞达志
后藤正喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN119604980A publication Critical patent/CN119604980A/zh
Application granted granted Critical
Publication of CN119604980B publication Critical patent/CN119604980B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202280097747.6A 2022-10-13 2022-10-13 电力半导体装置及电力半导体装置的制造方法 Active CN119604980B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038210 WO2024079846A1 (ja) 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN119604980A CN119604980A (zh) 2025-03-11
CN119604980B true CN119604980B (zh) 2026-01-16

Family

ID=85980405

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280097747.6A Active CN119604980B (zh) 2022-10-13 2022-10-13 电力半导体装置及电力半导体装置的制造方法

Country Status (4)

Country Link
US (1) US20250167073A1 (https=)
JP (1) JP7258269B1 (https=)
CN (1) CN119604980B (https=)
WO (1) WO2024079846A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121400138A (zh) * 2023-07-27 2026-01-23 三菱电机株式会社 电力半导体装置
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220334A (ja) * 2013-05-07 2014-11-20 株式会社安川電機 電力変換装置
CN104576569A (zh) * 2013-10-16 2015-04-29 本田技研工业株式会社 半导体装置

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EP0835524A1 (de) * 1996-01-04 1998-04-15 Daimler-Benz Aktiengesellschaft Kühlkörper mit zapfen
JP2001035981A (ja) * 1999-07-16 2001-02-09 Toshiba Corp 半導体素子用冷却器及びこれを用いた電力変換装置
US6414867B2 (en) * 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
WO2007032056A1 (ja) * 2005-09-13 2007-03-22 Mitsubishi Denki Kabushiki Kaisha ヒートシンク
TWM300577U (en) * 2006-05-25 2006-11-11 Cooler Master Co Ltd Perforation spreading jig of heat-dissipating fin
JP5084527B2 (ja) * 2008-01-23 2012-11-28 三菱電機株式会社 ヒートシンクおよび電気機器
JP5314933B2 (ja) * 2008-06-02 2013-10-16 本田技研工業株式会社 電力変換装置
JP5089662B2 (ja) * 2009-08-04 2012-12-05 三菱電機株式会社 半導体モジュール
EP2465138B1 (en) * 2009-08-10 2016-11-23 Fuji Electric Co., Ltd. Semiconductor module and cooling unit
JP2011155207A (ja) * 2010-01-28 2011-08-11 Aisin Aw Co Ltd インバータモジュールの製造方法及びインバータモジュール
KR101533895B1 (ko) * 2010-09-02 2015-07-03 도요타지도샤가부시키가이샤 반도체 모듈
CN101975376B (zh) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 背光模块的发光源散热构造
JPWO2012157247A1 (ja) * 2011-05-16 2014-07-31 富士電機株式会社 半導体モジュール用冷却器
US20130027885A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Heat spreader for multi-chip modules
JP5716610B2 (ja) * 2011-08-30 2015-05-13 株式会社デンソー 電力変換装置
JP2013074721A (ja) * 2011-09-28 2013-04-22 Denso Corp 電力変換装置
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
JP2012199596A (ja) * 2012-07-25 2012-10-18 Mitsubishi Electric Corp 半導体モジュール
JP6318857B2 (ja) * 2014-05-27 2018-05-09 富士通株式会社 ヒートシンク及び基板ユニット
JP6789335B2 (ja) * 2019-03-05 2020-11-25 三菱電機株式会社 ヒートシンク及びこれを備えた半導体モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220334A (ja) * 2013-05-07 2014-11-20 株式会社安川電機 電力変換装置
CN104576569A (zh) * 2013-10-16 2015-04-29 本田技研工业株式会社 半导体装置

Also Published As

Publication number Publication date
CN119604980A (zh) 2025-03-11
JP7258269B1 (ja) 2023-04-14
WO2024079846A1 (ja) 2024-04-18
US20250167073A1 (en) 2025-05-22
JPWO2024079846A1 (https=) 2024-04-18

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