JP7258269B1 - 電力半導体装置および電力半導体装置の製造方法 - Google Patents

電力半導体装置および電力半導体装置の製造方法 Download PDF

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Publication number
JP7258269B1
JP7258269B1 JP2023509445A JP2023509445A JP7258269B1 JP 7258269 B1 JP7258269 B1 JP 7258269B1 JP 2023509445 A JP2023509445 A JP 2023509445A JP 2023509445 A JP2023509445 A JP 2023509445A JP 7258269 B1 JP7258269 B1 JP 7258269B1
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Prior art keywords
heat sink
semiconductor device
housing
structural support
power semiconductor
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JP2023509445A
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Japanese (ja)
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JPWO2024079846A5 (https=
JPWO2024079846A1 (https=
Inventor
泰之 三田
達志 森貞
正喜 後藤
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023509445A 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法 Active JP7258269B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/038210 WO2024079846A1 (ja) 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP7258269B1 true JP7258269B1 (ja) 2023-04-14
JPWO2024079846A1 JPWO2024079846A1 (https=) 2024-04-18
JPWO2024079846A5 JPWO2024079846A5 (https=) 2024-09-11

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JP2023509445A Active JP7258269B1 (ja) 2022-10-13 2022-10-13 電力半導体装置および電力半導体装置の製造方法

Country Status (4)

Country Link
US (1) US20250167073A1 (https=)
JP (1) JP7258269B1 (https=)
CN (1) CN119604980B (https=)
WO (1) WO2024079846A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7479580B1 (ja) * 2023-07-27 2024-05-08 三菱電機株式会社 電力半導体装置
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置

Citations (3)

* Cited by examiner, † Cited by third party
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WO2012029165A1 (ja) * 2010-09-02 2012-03-08 トヨタ自動車株式会社 半導体モジュール
JP2012199596A (ja) * 2012-07-25 2012-10-18 Mitsubishi Electric Corp 半導体モジュール
JP2014220334A (ja) * 2013-05-07 2014-11-20 株式会社安川電機 電力変換装置

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EP0835524A1 (de) * 1996-01-04 1998-04-15 Daimler-Benz Aktiengesellschaft Kühlkörper mit zapfen
JP2001035981A (ja) * 1999-07-16 2001-02-09 Toshiba Corp 半導体素子用冷却器及びこれを用いた電力変換装置
US6414867B2 (en) * 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
WO2007032056A1 (ja) * 2005-09-13 2007-03-22 Mitsubishi Denki Kabushiki Kaisha ヒートシンク
TWM300577U (en) * 2006-05-25 2006-11-11 Cooler Master Co Ltd Perforation spreading jig of heat-dissipating fin
JP5084527B2 (ja) * 2008-01-23 2012-11-28 三菱電機株式会社 ヒートシンクおよび電気機器
JP5314933B2 (ja) * 2008-06-02 2013-10-16 本田技研工業株式会社 電力変換装置
JP5089662B2 (ja) * 2009-08-04 2012-12-05 三菱電機株式会社 半導体モジュール
EP2465138B1 (en) * 2009-08-10 2016-11-23 Fuji Electric Co., Ltd. Semiconductor module and cooling unit
JP2011155207A (ja) * 2010-01-28 2011-08-11 Aisin Aw Co Ltd インバータモジュールの製造方法及びインバータモジュール
CN101975376B (zh) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 背光模块的发光源散热构造
JPWO2012157247A1 (ja) * 2011-05-16 2014-07-31 富士電機株式会社 半導体モジュール用冷却器
US20130027885A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Heat spreader for multi-chip modules
JP5716610B2 (ja) * 2011-08-30 2015-05-13 株式会社デンソー 電力変換装置
JP2013074721A (ja) * 2011-09-28 2013-04-22 Denso Corp 電力変換装置
JP5901343B2 (ja) * 2012-02-24 2016-04-06 三菱電機株式会社 冷却器及び冷却装置
JP6227970B2 (ja) * 2013-10-16 2017-11-08 本田技研工業株式会社 半導体装置
JP6318857B2 (ja) * 2014-05-27 2018-05-09 富士通株式会社 ヒートシンク及び基板ユニット
JP6789335B2 (ja) * 2019-03-05 2020-11-25 三菱電機株式会社 ヒートシンク及びこれを備えた半導体モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029165A1 (ja) * 2010-09-02 2012-03-08 トヨタ自動車株式会社 半導体モジュール
JP2012199596A (ja) * 2012-07-25 2012-10-18 Mitsubishi Electric Corp 半導体モジュール
JP2014220334A (ja) * 2013-05-07 2014-11-20 株式会社安川電機 電力変換装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7479580B1 (ja) * 2023-07-27 2024-05-08 三菱電機株式会社 電力半導体装置
WO2025022671A1 (ja) * 2023-07-27 2025-01-30 三菱電機株式会社 電力半導体装置
WO2025243727A1 (ja) * 2024-05-22 2025-11-27 三菱電機株式会社 電力半導体装置、及び、電力変換装置

Also Published As

Publication number Publication date
CN119604980B (zh) 2026-01-16
CN119604980A (zh) 2025-03-11
WO2024079846A1 (ja) 2024-04-18
US20250167073A1 (en) 2025-05-22
JPWO2024079846A1 (https=) 2024-04-18

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