JPWO2023176056A5 - - Google Patents

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Publication number
JPWO2023176056A5
JPWO2023176056A5 JP2024507509A JP2024507509A JPWO2023176056A5 JP WO2023176056 A5 JPWO2023176056 A5 JP WO2023176056A5 JP 2024507509 A JP2024507509 A JP 2024507509A JP 2024507509 A JP2024507509 A JP 2024507509A JP WO2023176056 A5 JPWO2023176056 A5 JP WO2023176056A5
Authority
JP
Japan
Prior art keywords
hole
inorganic film
film
semiconductor device
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024507509A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023176056A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/043800 external-priority patent/WO2023176056A1/ja
Publication of JPWO2023176056A1 publication Critical patent/JPWO2023176056A1/ja
Publication of JPWO2023176056A5 publication Critical patent/JPWO2023176056A5/ja
Pending legal-status Critical Current

Links

JP2024507509A 2022-03-14 2022-11-28 Pending JPWO2023176056A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022039205 2022-03-14
PCT/JP2022/043800 WO2023176056A1 (ja) 2022-03-14 2022-11-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023176056A1 JPWO2023176056A1 (https=) 2023-09-21
JPWO2023176056A5 true JPWO2023176056A5 (https=) 2024-11-20

Family

ID=88023190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507509A Pending JPWO2023176056A1 (https=) 2022-03-14 2022-11-28

Country Status (5)

Country Link
US (1) US20250006580A1 (https=)
JP (1) JPWO2023176056A1 (https=)
CN (1) CN118872068A (https=)
DE (1) DE112022006632T5 (https=)
WO (1) WO2023176056A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026058856A1 (ja) * 2024-09-13 2026-03-19 ローム株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6960602B2 (ja) * 2016-11-25 2021-11-05 パナソニックIpマネジメント株式会社 炭化珪素半導体装置
JP6846687B2 (ja) * 2017-09-12 2021-03-24 パナソニックIpマネジメント株式会社 半導体装置およびその製造方法
US20230103655A1 (en) * 2020-06-26 2023-04-06 Rohm Co., Ltd. Electronic component
JP2022039205A (ja) 2020-08-28 2022-03-10 株式会社不二越 油圧機器配管ポート閉止用プラグ
US20230335633A1 (en) * 2021-03-18 2023-10-19 Rohm Co., Ltd. Wide bandgap semiconductor device

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