JPWO2023084858A5 - - Google Patents
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- Publication number
- JPWO2023084858A5 JPWO2023084858A5 JP2023559431A JP2023559431A JPWO2023084858A5 JP WO2023084858 A5 JPWO2023084858 A5 JP WO2023084858A5 JP 2023559431 A JP2023559431 A JP 2023559431A JP 2023559431 A JP2023559431 A JP 2023559431A JP WO2023084858 A5 JPWO2023084858 A5 JP WO2023084858A5
- Authority
- JP
- Japan
- Prior art keywords
- depression
- electronic component
- component according
- viewed
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 239000011521 glass Substances 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021182603 | 2021-11-09 | ||
| JP2021182603 | 2021-11-09 | ||
| PCT/JP2022/030676 WO2023084858A1 (ja) | 2021-11-09 | 2022-08-10 | 電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023084858A1 JPWO2023084858A1 (https=) | 2023-05-19 |
| JPWO2023084858A5 true JPWO2023084858A5 (https=) | 2024-07-05 |
| JP7658455B2 JP7658455B2 (ja) | 2025-04-08 |
Family
ID=86335586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023559431A Active JP7658455B2 (ja) | 2021-11-09 | 2022-08-10 | 電子部品 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240112835A1 (https=) |
| JP (1) | JP7658455B2 (https=) |
| WO (1) | WO2023084858A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025115910A1 (ja) * | 2023-11-29 | 2025-06-05 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311676A (ja) * | 2003-04-07 | 2004-11-04 | Murata Mfg Co Ltd | チップ状積層セラミック電子部品の製造方法およびチップ状積層セラミック電子部品 |
| JP5180753B2 (ja) * | 2008-09-26 | 2013-04-10 | Ｔｄｋ株式会社 | セラミック積層電子部品およびその製造方法 |
| JP5471586B2 (ja) * | 2010-02-25 | 2014-04-16 | Ｔｄｋ株式会社 | チップ型電子部品 |
| JP5304757B2 (ja) * | 2010-09-06 | 2013-10-02 | Ｔｄｋ株式会社 | セラミック積層ｐｔｃサーミスタ |
| KR20170135146A (ko) * | 2016-05-30 | 2017-12-08 | 주식회사 모다이노칩 | 감전 방지 컨택터 |
| KR101825696B1 (ko) * | 2016-07-01 | 2018-02-05 | 주식회사 모다이노칩 | 칩 부품 및 그 제조 방법 |
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2022
- 2022-08-10 JP JP2023559431A patent/JP7658455B2/ja active Active
- 2022-08-10 WO PCT/JP2022/030676 patent/WO2023084858A1/ja not_active Ceased
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2023
- 2023-12-12 US US18/536,992 patent/US20240112835A1/en active Pending