JPWO2023176663A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023176663A5
JPWO2023176663A5 JP2024507820A JP2024507820A JPWO2023176663A5 JP WO2023176663 A5 JPWO2023176663 A5 JP WO2023176663A5 JP 2024507820 A JP2024507820 A JP 2024507820A JP 2024507820 A JP2024507820 A JP 2024507820A JP WO2023176663 A5 JPWO2023176663 A5 JP WO2023176663A5
Authority
JP
Japan
Prior art keywords
plate
electronic component
component according
resin portion
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024507820A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023176663A1 (https=
JP7729469B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008978 external-priority patent/WO2023176663A1/ja
Publication of JPWO2023176663A1 publication Critical patent/JPWO2023176663A1/ja
Publication of JPWO2023176663A5 publication Critical patent/JPWO2023176663A5/ja
Priority to JP2025133807A priority Critical patent/JP2025166124A/ja
Application granted granted Critical
Publication of JP7729469B2 publication Critical patent/JP7729469B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024507820A 2022-03-16 2023-03-09 電子部品 Active JP7729469B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025133807A JP2025166124A (ja) 2022-03-16 2025-08-08 電子部品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022041384 2022-03-16
JP2022041384 2022-03-16
PCT/JP2023/008978 WO2023176663A1 (ja) 2022-03-16 2023-03-09 電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025133807A Division JP2025166124A (ja) 2022-03-16 2025-08-08 電子部品

Publications (3)

Publication Number Publication Date
JPWO2023176663A1 JPWO2023176663A1 (https=) 2023-09-21
JPWO2023176663A5 true JPWO2023176663A5 (https=) 2024-08-26
JP7729469B2 JP7729469B2 (ja) 2025-08-26

Family

ID=88023243

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024507820A Active JP7729469B2 (ja) 2022-03-16 2023-03-09 電子部品
JP2025133807A Pending JP2025166124A (ja) 2022-03-16 2025-08-08 電子部品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025133807A Pending JP2025166124A (ja) 2022-03-16 2025-08-08 電子部品

Country Status (4)

Country Link
US (1) US20240420899A1 (https=)
JP (2) JP7729469B2 (https=)
CN (1) CN118901115A (https=)
WO (1) WO2023176663A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166018A (ja) * 2008-12-16 2010-07-29 Seiko Instruments Inc 電子部品およびその製造方法
JP2010153691A (ja) * 2008-12-26 2010-07-08 Seiko Instruments Inc 電子デバイスの製造方法
JP6342643B2 (ja) * 2013-10-25 2018-06-13 セイコーインスツル株式会社 電子デバイス
JP6962052B2 (ja) * 2017-07-31 2021-11-05 大日本印刷株式会社 電子部品搭載基板およびその製造方法
DE102020114952B4 (de) * 2020-06-05 2024-07-18 Schott Ag Hermetisch dichtes optoelektronisches Modul mit erhöhter Auskopplung von elektromagnetischer Strahlung

Similar Documents

Publication Publication Date Title
CN108366330B (zh) 微机电封装结构
JP2008516787A5 (https=)
JP2011114192A5 (https=)
JP2012109297A5 (https=)
US10405102B2 (en) MEMS transducer package
JPS6468728A (en) Thin film transistor
JPWO2023176663A5 (https=)
JPH04307769A (ja) 電子デバイス及びその形成方法
JPWO2023084858A5 (https=)
JP2007139517A (ja) 圧力センサの製造方法並びに圧力センサ及び圧力センサの実装方法
JPWO2022264969A5 (https=)
JPWO2023140001A5 (https=)
JP2009218788A5 (https=)
CN207909163U (zh) 指纹识别模组及设有该指纹识别模组的电子设备
JPWO2024166733A5 (https=)
JP2598301Y2 (ja) チップ圧電振動子
US11043945B2 (en) Capacitance-variable pressure sensor
JPWO2025150213A5 (https=)
JPWO2023058487A5 (https=)
JPWO2024181322A5 (https=)
JPWO2024075463A5 (https=)
JPH05149815A (ja) 絶対圧型圧力センサ
JPWO2023145111A5 (https=)
JPH0263542U (https=)
JPWO2023182051A5 (https=)