JP2012109297A5 - - Google Patents
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- Publication number
- JP2012109297A5 JP2012109297A5 JP2010254870A JP2010254870A JP2012109297A5 JP 2012109297 A5 JP2012109297 A5 JP 2012109297A5 JP 2010254870 A JP2010254870 A JP 2010254870A JP 2010254870 A JP2010254870 A JP 2010254870A JP 2012109297 A5 JP2012109297 A5 JP 2012109297A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- recess
- hole
- support
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000005388 borosilicate glass Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010254870A JP5636265B2 (ja) | 2010-11-15 | 2010-11-15 | 半導体パッケージ及びその製造方法 |
| US13/295,158 US20120119391A1 (en) | 2010-11-15 | 2011-11-14 | Semiconductor package and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010254870A JP5636265B2 (ja) | 2010-11-15 | 2010-11-15 | 半導体パッケージ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012109297A JP2012109297A (ja) | 2012-06-07 |
| JP2012109297A5 true JP2012109297A5 (https=) | 2013-10-31 |
| JP5636265B2 JP5636265B2 (ja) | 2014-12-03 |
Family
ID=46047063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010254870A Active JP5636265B2 (ja) | 2010-11-15 | 2010-11-15 | 半導体パッケージ及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120119391A1 (https=) |
| JP (1) | JP5636265B2 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2720380B2 (ja) | 1995-08-30 | 1998-03-04 | ショーボンド建設株式会社 | Ｐｃ鋼より線先端保護具 |
| US9087847B2 (en) | 2012-08-14 | 2015-07-21 | Bridge Semiconductor Corporation | Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same |
| US20140048955A1 (en) * | 2012-08-14 | 2014-02-20 | Bridge Semiconductor Corporation | Semiconductor assembly board with back-to-back embedded semiconductor devices and built-in stoppers |
| US8901435B2 (en) | 2012-08-14 | 2014-12-02 | Bridge Semiconductor Corporation | Hybrid wiring board with built-in stopper, interposer and build-up circuitry |
| US20140048950A1 (en) * | 2012-08-14 | 2014-02-20 | Bridge Semiconductor Corporation | Thermally enhanced semiconductor assembly with embedded semiconductor device and built-in stopper and method of making the same |
| CN103811475A (zh) * | 2012-11-02 | 2014-05-21 | 钰桥半导体股份有限公司 | 具有背对背内嵌半导体元件及内建定位件的半导体组体板 |
| CN105428327B (zh) * | 2014-08-28 | 2018-03-23 | 联华电子股份有限公司 | 扇出型晶片级封装结构 |
| TWI581387B (zh) * | 2014-09-11 | 2017-05-01 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
| KR102065943B1 (ko) * | 2015-04-17 | 2020-01-14 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 및 그 제조 방법 |
| US9929100B2 (en) * | 2015-04-17 | 2018-03-27 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and method of manufacturing the same |
| TWI550783B (zh) * | 2015-04-24 | 2016-09-21 | 矽品精密工業股份有限公司 | 電子封裝件之製法及電子封裝結構 |
| CN105023900A (zh) * | 2015-08-11 | 2015-11-04 | 华天科技（昆山）电子有限公司 | 埋入硅基板扇出型封装结构及其制造方法 |
| US10083888B2 (en) * | 2015-11-19 | 2018-09-25 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| JP6761592B2 (ja) * | 2016-03-31 | 2020-09-30 | 大日本印刷株式会社 | 電子デバイス及びその製造方法 |
| KR101942746B1 (ko) * | 2017-11-29 | 2019-01-28 | 삼성전기 주식회사 | 팬-아웃 반도체 패키지 |
| US10340249B1 (en) * | 2018-06-25 | 2019-07-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
| CN114038843B (zh) * | 2020-10-24 | 2025-09-05 | Pep创新私人有限公司 | 芯片封装、芯片结构及其制造方法 |
| JP7410898B2 (ja) | 2021-03-11 | 2024-01-10 | アオイ電子株式会社 | 半導体装置の製造方法および半導体装置 |
| CN117672981A (zh) * | 2022-08-16 | 2024-03-08 | 华为技术有限公司 | 芯片封装结构、封装方法、电子设备 |
| KR20250063190A (ko) * | 2023-10-31 | 2025-05-08 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 패키징 기판의 제조 방법 |
| EP4560693A1 (en) * | 2023-11-23 | 2025-05-28 | Absolics Inc. | Packaging substrate and manufacturing method of packaging substrate |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254697A (ja) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 多層セラミック回路基板および製法 |
| US4803450A (en) * | 1987-12-14 | 1989-02-07 | General Electric Company | Multilayer circuit board fabricated from silicon |
| JP3921320B2 (ja) * | 2000-01-31 | 2007-05-30 | 日本電気株式会社 | 熱型赤外線検出器およびその製造方法 |
| US6309912B1 (en) * | 2000-06-20 | 2001-10-30 | Motorola, Inc. | Method of interconnecting an embedded integrated circuit |
| JP2002016173A (ja) * | 2000-06-30 | 2002-01-18 | Mitsubishi Electric Corp | 半導体装置 |
| US20020070443A1 (en) * | 2000-12-08 | 2002-06-13 | Xiao-Chun Mu | Microelectronic package having an integrated heat sink and build-up layers |
| US6680529B2 (en) * | 2002-02-15 | 2004-01-20 | Advanced Semiconductor Engineering, Inc. | Semiconductor build-up package |
| US6925710B1 (en) * | 2002-03-27 | 2005-08-09 | Analog Devices, Inc. | Method for manufacturing microelectromechanical combdrive device |
| JP4028749B2 (ja) * | 2002-04-15 | 2007-12-26 | 日本特殊陶業株式会社 | 配線基板 |
| JP4184701B2 (ja) * | 2002-04-19 | 2008-11-19 | エスアイアイ・ナノテクノロジー株式会社 | 放射線検出器 |
| JP3888267B2 (ja) * | 2002-08-30 | 2007-02-28 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| JP3617647B2 (ja) * | 2002-11-08 | 2005-02-09 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
| JP4390541B2 (ja) * | 2003-02-03 | 2009-12-24 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| US7744830B2 (en) * | 2004-04-29 | 2010-06-29 | Lawrence Livermore National Security, Llc | Catalyst for microelectromechanical systems microreactors |
| US7413846B2 (en) * | 2004-11-15 | 2008-08-19 | Microchips, Inc. | Fabrication methods and structures for micro-reservoir devices |
| TWI255518B (en) * | 2005-01-19 | 2006-05-21 | Via Tech Inc | Chip package |
| JP2007027279A (ja) * | 2005-07-13 | 2007-02-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| JP4828559B2 (ja) * | 2008-03-24 | 2011-11-30 | 新光電気工業株式会社 | 配線基板の製造方法及び電子装置の製造方法 |
| EP2286290A4 (en) * | 2008-05-09 | 2015-04-01 | Hewlett Packard Development Co | METHODS OF MANUFACTURING HOLLOW WAVEGUIDES WITH LARGE SIZE |
| JP5367616B2 (ja) * | 2009-02-23 | 2013-12-11 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| US7754519B1 (en) * | 2009-05-13 | 2010-07-13 | Twin Creeks Technologies, Inc. | Methods of forming a photovoltaic cell |
-
2010
- 2010-11-15 JP JP2010254870A patent/JP5636265B2/ja active Active
-
2011
- 2011-11-14 US US13/295,158 patent/US20120119391A1/en not_active Abandoned