JPWO2024075463A5 - - Google Patents

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Publication number
JPWO2024075463A5
JPWO2024075463A5 JP2024555675A JP2024555675A JPWO2024075463A5 JP WO2024075463 A5 JPWO2024075463 A5 JP WO2024075463A5 JP 2024555675 A JP2024555675 A JP 2024555675A JP 2024555675 A JP2024555675 A JP 2024555675A JP WO2024075463 A5 JPWO2024075463 A5 JP WO2024075463A5
Authority
JP
Japan
Prior art keywords
circuit pattern
semiconductor device
region
wall portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024555675A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024075463A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/032467 external-priority patent/WO2024075463A1/ja
Publication of JPWO2024075463A1 publication Critical patent/JPWO2024075463A1/ja
Publication of JPWO2024075463A5 publication Critical patent/JPWO2024075463A5/ja
Pending legal-status Critical Current

Links

JP2024555675A 2022-10-07 2023-09-06 Pending JPWO2024075463A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022162390 2022-10-07
PCT/JP2023/032467 WO2024075463A1 (ja) 2022-10-07 2023-09-06 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024075463A1 JPWO2024075463A1 (https=) 2024-04-11
JPWO2024075463A5 true JPWO2024075463A5 (https=) 2025-06-18

Family

ID=90607824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555675A Pending JPWO2024075463A1 (https=) 2022-10-07 2023-09-06

Country Status (3)

Country Link
US (1) US20260114318A1 (https=)
JP (1) JPWO2024075463A1 (https=)
WO (1) WO2024075463A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101933139B (zh) * 2007-12-20 2012-11-07 爱信艾达株式会社 半导体装置及其制造方法
CN110178219B (zh) * 2017-01-17 2022-11-22 三菱电机株式会社 半导体装置以及电力变换装置
JP6907670B2 (ja) * 2017-04-17 2021-07-21 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP7489241B2 (ja) * 2020-06-25 2024-05-23 株式会社 日立パワーデバイス パワーモジュール

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