JPWO2024057860A5 - - Google Patents

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Publication number
JPWO2024057860A5
JPWO2024057860A5 JP2024546812A JP2024546812A JPWO2024057860A5 JP WO2024057860 A5 JPWO2024057860 A5 JP WO2024057860A5 JP 2024546812 A JP2024546812 A JP 2024546812A JP 2024546812 A JP2024546812 A JP 2024546812A JP WO2024057860 A5 JPWO2024057860 A5 JP WO2024057860A5
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JP
Japan
Prior art keywords
sub
metal layer
semiconductor device
region
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024546812A
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English (en)
Japanese (ja)
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JPWO2024057860A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2023/030456 external-priority patent/WO2024057860A1/ja
Publication of JPWO2024057860A1 publication Critical patent/JPWO2024057860A1/ja
Publication of JPWO2024057860A5 publication Critical patent/JPWO2024057860A5/ja
Pending legal-status Critical Current

Links

JP2024546812A 2022-09-13 2023-08-24 Pending JPWO2024057860A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022145138 2022-09-13
JP2023014398 2023-02-02
PCT/JP2023/030456 WO2024057860A1 (ja) 2022-09-13 2023-08-24 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024057860A1 JPWO2024057860A1 (https=) 2024-03-21
JPWO2024057860A5 true JPWO2024057860A5 (https=) 2025-05-23

Family

ID=90274865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546812A Pending JPWO2024057860A1 (https=) 2022-09-13 2023-08-24

Country Status (5)

Country Link
US (1) US20250210532A1 (https=)
JP (1) JPWO2024057860A1 (https=)
CN (1) CN119856282A (https=)
DE (1) DE112023003434T5 (https=)
WO (1) WO2024057860A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110235244B (zh) * 2017-02-06 2023-06-27 三菱电机株式会社 功率半导体模块以及电力转换装置
JP6755386B2 (ja) * 2017-04-21 2020-09-16 三菱電機株式会社 電力用半導体モジュールおよび電力用半導体モジュールの製造方法
JP7326314B2 (ja) * 2018-10-02 2023-08-15 ローム株式会社 半導体装置および半導体装置の製造方法
JP7459672B2 (ja) * 2020-06-10 2024-04-02 住友電気工業株式会社 半導体装置
DE112021002452T5 (de) * 2020-10-14 2023-02-09 Rohm Co., Ltd. Halbleitermodul

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