JPWO2020235175A5 - - Google Patents

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Publication number
JPWO2020235175A5
JPWO2020235175A5 JP2021520060A JP2021520060A JPWO2020235175A5 JP WO2020235175 A5 JPWO2020235175 A5 JP WO2020235175A5 JP 2021520060 A JP2021520060 A JP 2021520060A JP 2021520060 A JP2021520060 A JP 2021520060A JP WO2020235175 A5 JPWO2020235175 A5 JP WO2020235175A5
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JP
Japan
Prior art keywords
electrode
dielectric film
capacitor according
via hole
upper electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021520060A
Other languages
English (en)
Japanese (ja)
Other versions
JP7484903B2 (ja
JPWO2020235175A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2020/008963 external-priority patent/WO2020235175A1/ja
Publication of JPWO2020235175A1 publication Critical patent/JPWO2020235175A1/ja
Publication of JPWO2020235175A5 publication Critical patent/JPWO2020235175A5/ja
Application granted granted Critical
Publication of JP7484903B2 publication Critical patent/JP7484903B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021520060A 2019-05-21 2020-03-03 キャパシタ Active JP7484903B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019095379 2019-05-21
JP2019095379 2019-05-21
PCT/JP2020/008963 WO2020235175A1 (ja) 2019-05-21 2020-03-03 キャパシタ

Publications (3)

Publication Number Publication Date
JPWO2020235175A1 JPWO2020235175A1 (https=) 2020-11-26
JPWO2020235175A5 true JPWO2020235175A5 (https=) 2022-09-05
JP7484903B2 JP7484903B2 (ja) 2024-05-16

Family

ID=73458757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520060A Active JP7484903B2 (ja) 2019-05-21 2020-03-03 キャパシタ

Country Status (4)

Country Link
US (1) US12432945B2 (https=)
JP (1) JP7484903B2 (https=)
CN (1) CN113841230A (https=)
WO (1) WO2020235175A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250329499A1 (en) * 2022-06-27 2025-10-23 Tdk Corporation Thin film capacitor and electronic circuit having the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257532B2 (ja) * 1992-07-27 2002-02-18 株式会社村田製作所 積層電子部品の製造方法およびその特性測定方法
EP1182708A3 (en) * 2000-08-18 2002-03-27 Texas Instruments Incorporated High capacitance damascene capacitor
JP2003188265A (ja) * 2001-12-19 2003-07-04 Matsushita Electric Ind Co Ltd Ｍｉｍ型容量素子の製造方法
KR100684438B1 (ko) * 2004-08-06 2007-02-16 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조 방법
JP4998262B2 (ja) * 2005-07-05 2012-08-15 富士通セミコンダクター株式会社 半導体装置及びその製造方法
CN100485931C (zh) * 2006-01-19 2009-05-06 力晶半导体股份有限公司 半导体元件及其制造方法
CN101192568A (zh) * 2006-11-24 2008-06-04 和舰科技(苏州)有限公司 集成电路中“金属-绝缘体-金属”电容器结构及其制造方法
JP2009010114A (ja) * 2007-06-27 2009-01-15 Murata Mfg Co Ltd 誘電体薄膜キャパシタ
JP4450071B2 (ja) * 2007-12-28 2010-04-14 Ｔｄｋ株式会社 電子部品
JP2009295925A (ja) * 2008-06-09 2009-12-17 Tdk Corp トレンチ型コンデンサ及びその製造方法
US8379365B2 (en) * 2009-04-28 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Metal oxide metal capacitor with slot vias
CN102576608B (zh) * 2009-09-30 2015-06-03 株式会社半导体能源研究所 氧化还原电容器以及其制造方法
US8896521B2 (en) * 2012-04-24 2014-11-25 Qualcomm Mems Technologies, Inc. Metal-insulator-metal capacitors on glass substrates
JP6795327B2 (ja) * 2016-04-22 2020-12-02 ローム株式会社 チップコンデンサ
US10607779B2 (en) 2016-04-22 2020-03-31 Rohm Co., Ltd. Chip capacitor having capacitor region directly below external electrode
JPWO2018003445A1 (ja) * 2016-06-28 2019-03-07 株式会社村田製作所 キャパシタ
US10468187B2 (en) * 2016-08-05 2019-11-05 Samsung Electro-Mechanics Co., Ltd. Thin-film ceramic capacitor having capacitance forming portions separated by separation slit
CN110959188B (zh) 2017-07-26 2023-10-03 株式会社村田制作所 电容器
WO2019026641A1 (ja) * 2017-07-31 2019-02-07 株式会社村田製作所 薄膜コンデンサ及びその製造方法

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