JP7658455B2 - 電子部品 - Google Patents

電子部品 Download PDF

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Publication number
JP7658455B2
JP7658455B2 JP2023559431A JP2023559431A JP7658455B2 JP 7658455 B2 JP7658455 B2 JP 7658455B2 JP 2023559431 A JP2023559431 A JP 2023559431A JP 2023559431 A JP2023559431 A JP 2023559431A JP 7658455 B2 JP7658455 B2 JP 7658455B2
Authority
JP
Japan
Prior art keywords
depression
element body
glass film
viewed
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023559431A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023084858A1 (https=
JPWO2023084858A5 (https=
Inventor
知也 大島
悠太 星野
耕市 山田
美希 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023084858A1 publication Critical patent/JPWO2023084858A1/ja
Publication of JPWO2023084858A5 publication Critical patent/JPWO2023084858A5/ja
Application granted granted Critical
Publication of JP7658455B2 publication Critical patent/JP7658455B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2023559431A 2021-11-09 2022-08-10 電子部品 Active JP7658455B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021182603 2021-11-09
JP2021182603 2021-11-09
PCT/JP2022/030676 WO2023084858A1 (ja) 2021-11-09 2022-08-10 電子部品

Publications (3)

Publication Number Publication Date
JPWO2023084858A1 JPWO2023084858A1 (https=) 2023-05-19
JPWO2023084858A5 JPWO2023084858A5 (https=) 2024-07-05
JP7658455B2 true JP7658455B2 (ja) 2025-04-08

Family

ID=86335586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559431A Active JP7658455B2 (ja) 2021-11-09 2022-08-10 電子部品

Country Status (3)

Country Link
US (1) US20240112835A1 (https=)
JP (1) JP7658455B2 (https=)
WO (1) WO2023084858A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025115910A1 (ja) * 2023-11-29 2025-06-05 株式会社村田製作所 電子部品及び電子部品の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311676A (ja) 2003-04-07 2004-11-04 Murata Mfg Co Ltd チップ状積層セラミック電子部品の製造方法およびチップ状積層セラミック電子部品
JP2010080703A (ja) 2008-09-26 2010-04-08 Tdk Corp セラミック積層電子部品およびその製造方法
JP2011176238A (ja) 2010-02-25 2011-09-08 Tdk Corp チップ型電子部品
JP2012059786A (ja) 2010-09-06 2012-03-22 Tdk Corp セラミック積層ｐｔｃサーミスタ
CN109478465A (zh) 2016-07-01 2019-03-15 摩达伊诺琴股份有限公司 芯片构件及其制造方法
US20190141825A1 (en) 2016-05-30 2019-05-09 Moda-Innochips Co., Ltd. Contactor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311676A (ja) 2003-04-07 2004-11-04 Murata Mfg Co Ltd チップ状積層セラミック電子部品の製造方法およびチップ状積層セラミック電子部品
JP2010080703A (ja) 2008-09-26 2010-04-08 Tdk Corp セラミック積層電子部品およびその製造方法
JP2011176238A (ja) 2010-02-25 2011-09-08 Tdk Corp チップ型電子部品
JP2012059786A (ja) 2010-09-06 2012-03-22 Tdk Corp セラミック積層ｐｔｃサーミスタ
US20190141825A1 (en) 2016-05-30 2019-05-09 Moda-Innochips Co., Ltd. Contactor
CN109478465A (zh) 2016-07-01 2019-03-15 摩达伊诺琴股份有限公司 芯片构件及其制造方法

Also Published As

Publication number Publication date
US20240112835A1 (en) 2024-04-04
WO2023084858A1 (ja) 2023-05-19
JPWO2023084858A1 (https=) 2023-05-19

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