JPWO2024225235A5 - - Google Patents

Info

Publication number
JPWO2024225235A5
JPWO2024225235A5 JP2025516803A JP2025516803A JPWO2024225235A5 JP WO2024225235 A5 JPWO2024225235 A5 JP WO2024225235A5 JP 2025516803 A JP2025516803 A JP 2025516803A JP 2025516803 A JP2025516803 A JP 2025516803A JP WO2024225235 A5 JPWO2024225235 A5 JP WO2024225235A5
Authority
JP
Japan
Prior art keywords
electronic component
frame
lid
component storage
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025516803A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024225235A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/015797 external-priority patent/WO2024225235A1/ja
Publication of JPWO2024225235A1 publication Critical patent/JPWO2024225235A1/ja
Publication of JPWO2024225235A5 publication Critical patent/JPWO2024225235A5/ja
Pending legal-status Critical Current

Links

JP2025516803A 2023-04-25 2024-04-23 Pending JPWO2024225235A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023071665 2023-04-25
PCT/JP2024/015797 WO2024225235A1 (ja) 2023-04-25 2024-04-23 電子部品収納用パッケージおよび電子モジュール

Publications (2)

Publication Number Publication Date
JPWO2024225235A1 JPWO2024225235A1 (https=) 2024-10-31
JPWO2024225235A5 true JPWO2024225235A5 (https=) 2026-01-27

Family

ID=93256444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516803A Pending JPWO2024225235A1 (https=) 2023-04-25 2024-04-23

Country Status (2)

Country Link
JP (1) JPWO2024225235A1 (https=)
WO (1) WO2024225235A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02116740U (https=) * 1989-03-03 1990-09-19
WO2023054246A1 (ja) * 2021-09-30 2023-04-06 京セラ株式会社 電子部品搭載用パッケージ及び電子装置

Similar Documents

Publication Publication Date Title
JP7767970B2 (ja) 半導体モジュール
KR970077555A (ko) 적층형 버텀 리드 패키지
TWI478479B (zh) 整合功率模組封裝結構
KR100214549B1 (ko) 버텀리드 반도체 패키지
JP6435794B2 (ja) 半導体装置
CN101752327A (zh) 具有散热结构的半导体封装件
US4712127A (en) High reliability metal and resin container for a semiconductor device
JPWO2024225235A5 (https=)
JP2006501652A5 (https=)
JPS598362Y2 (ja) セラミツクスパツケ−ジ
JP2577639Y2 (ja) 回路基板を有する半導体装置
JP5971133B2 (ja) 回路基板
US6583501B2 (en) Lead frame for an integrated circuit chip (integrated circuit peripheral support)
JP7506636B2 (ja) 配線基板
JP2503682B2 (ja) 電子部品
JPWO2024242165A5 (https=)
JPS61104630A (ja) 半導体装置
JPS61111599A (ja) 混成集積回路装置
JPWO2024181272A5 (https=)
WO2024101190A1 (ja) 半導体装置
JP2021175002A (ja) 水晶発振器およびセラミック製パッケージ
KR970030700A (ko) 반도체 패키지의 히트싱크 제조방법 및 그 구조
JPH04179256A (ja) 半導体装置
KR200286322Y1 (ko) 반도체패키지
JPH0363942U (https=)