JPWO2024225235A1 - - Google Patents
Info
- Publication number
- JPWO2024225235A1 JPWO2024225235A1 JP2025516803A JP2025516803A JPWO2024225235A1 JP WO2024225235 A1 JPWO2024225235 A1 JP WO2024225235A1 JP 2025516803 A JP2025516803 A JP 2025516803A JP 2025516803 A JP2025516803 A JP 2025516803A JP WO2024225235 A1 JPWO2024225235 A1 JP WO2024225235A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023071665 | 2023-04-25 | ||
| PCT/JP2024/015797 WO2024225235A1 (ja) | 2023-04-25 | 2024-04-23 | 電子部品収納用パッケージおよび電子モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225235A1 true JPWO2024225235A1 (https=) | 2024-10-31 |
| JPWO2024225235A5 JPWO2024225235A5 (https=) | 2026-01-27 |
Family
ID=93256444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516803A Pending JPWO2024225235A1 (https=) | 2023-04-25 | 2024-04-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024225235A1 (https=) |
| WO (1) | WO2024225235A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02116740U (https=) * | 1989-03-03 | 1990-09-19 | ||
| WO2023054246A1 (ja) * | 2021-09-30 | 2023-04-06 | 京セラ株式会社 | 電子部品搭載用パッケージ及び電子装置 |
-
2024
- 2024-04-23 WO PCT/JP2024/015797 patent/WO2024225235A1/ja not_active Ceased
- 2024-04-23 JP JP2025516803A patent/JPWO2024225235A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024225235A1 (ja) | 2024-10-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251022 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251022 |