JPWO2023032653A5 - - Google Patents
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- Publication number
- JPWO2023032653A5 JPWO2023032653A5 JP2023545418A JP2023545418A JPWO2023032653A5 JP WO2023032653 A5 JPWO2023032653 A5 JP WO2023032653A5 JP 2023545418 A JP2023545418 A JP 2023545418A JP 2023545418 A JP2023545418 A JP 2023545418A JP WO2023032653 A5 JPWO2023032653 A5 JP WO2023032653A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring portion
- slit
- semiconductor device
- wiring
- passivation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021144038 | 2021-09-03 | ||
| PCT/JP2022/030909 WO2023032653A1 (ja) | 2021-09-03 | 2022-08-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032653A1 JPWO2023032653A1 (https=) | 2023-03-09 |
| JPWO2023032653A5 true JPWO2023032653A5 (https=) | 2024-05-27 |
Family
ID=85411050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545418A Pending JPWO2023032653A1 (https=) | 2021-09-03 | 2022-08-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240203814A1 (https=) |
| JP (1) | JPWO2023032653A1 (https=) |
| CN (1) | CN117882199A (https=) |
| DE (1) | DE112022003512T5 (https=) |
| WO (1) | WO2023032653A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7788978B2 (ja) * | 2022-09-21 | 2025-12-19 | 株式会社東芝 | 半導体装置 |
| JP2024067820A (ja) * | 2022-11-07 | 2024-05-17 | ローム株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6719090B2 (ja) * | 2016-12-19 | 2020-07-08 | パナソニックＩｐマネジメント株式会社 | 半導体素子 |
| DE212020000212U1 (de) * | 2019-04-19 | 2020-10-20 | Rohm Co. Ltd. | SiC-Halbleiterbauteil |
-
2022
- 2022-08-15 JP JP2023545418A patent/JPWO2023032653A1/ja active Pending
- 2022-08-15 WO PCT/JP2022/030909 patent/WO2023032653A1/ja not_active Ceased
- 2022-08-15 DE DE112022003512.9T patent/DE112022003512T5/de active Pending
- 2022-08-15 CN CN202280058021.1A patent/CN117882199A/zh active Pending
-
2024
- 2024-02-27 US US18/588,034 patent/US20240203814A1/en active Pending
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