JPWO2023189037A5 - - Google Patents

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Publication number
JPWO2023189037A5
JPWO2023189037A5 JP2024511457A JP2024511457A JPWO2023189037A5 JP WO2023189037 A5 JPWO2023189037 A5 JP WO2023189037A5 JP 2024511457 A JP2024511457 A JP 2024511457A JP 2024511457 A JP2024511457 A JP 2024511457A JP WO2023189037 A5 JPWO2023189037 A5 JP WO2023189037A5
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JP
Japan
Prior art keywords
wiring layer
semiconductor device
power amplifying
view
layer
Prior art date
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Application number
JP2024511457A
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English (en)
Japanese (ja)
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JP7577895B2 (ja
JPWO2023189037A1 (https=
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Priority claimed from PCT/JP2023/006448 external-priority patent/WO2023189037A1/ja
Publication of JPWO2023189037A1 publication Critical patent/JPWO2023189037A1/ja
Publication of JPWO2023189037A5 publication Critical patent/JPWO2023189037A5/ja
Application granted granted Critical
Publication of JP7577895B2 publication Critical patent/JP7577895B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024511457A 2022-03-29 2023-02-22 電力増幅半導体装置 Active JP7577895B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263324957P 2022-03-29 2022-03-29
US63/324,957 2022-03-29
PCT/JP2023/006448 WO2023189037A1 (ja) 2022-03-29 2023-02-22 電力増幅半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023189037A1 JPWO2023189037A1 (https=) 2023-10-05
JPWO2023189037A5 true JPWO2023189037A5 (https=) 2024-08-16
JP7577895B2 JP7577895B2 (ja) 2024-11-05

Family

ID=88200470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511457A Active JP7577895B2 (ja) 2022-03-29 2023-02-22 電力増幅半導体装置

Country Status (4)

Country Link
US (1) US12278601B2 (https=)
JP (1) JP7577895B2 (https=)
CN (1) CN118974949B (https=)
WO (1) WO2023189037A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118841398B (zh) * 2023-04-24 2025-11-28 苏州能讯高能半导体有限公司 一种半导体器件及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3578533D1 (de) 1984-04-28 1990-08-09 Sony Corp Halbleiterbauelement mit von source- und/oder drain-gebieten umgebenen anschlussflaechen.
JPS60231370A (ja) * 1984-04-28 1985-11-16 Sony Corp 半導体装置
US7583309B2 (en) 2002-06-28 2009-09-01 Kyocera Coproration Imaging device package camera module and camera module producing method
JP2004260082A (ja) 2003-02-27 2004-09-16 Kyocera Corp 撮像装置の実装構造
JP2008182158A (ja) * 2007-01-26 2008-08-07 Eudyna Devices Inc 半導体装置
WO2009101870A1 (ja) * 2008-02-12 2009-08-20 Nec Corporation 半導体装置
JP2009239115A (ja) * 2008-03-27 2009-10-15 Panasonic Corp 半導体装置およびその製造方法
JP5407667B2 (ja) * 2008-11-05 2014-02-05 株式会社村田製作所 半導体装置
JP5218497B2 (ja) * 2009-12-04 2013-06-26 株式会社デンソー 半導体装置およびその製造方法
JP2013110149A (ja) * 2011-11-17 2013-06-06 Renesas Electronics Corp 半導体装置およびその製造方法
JP6350759B2 (ja) 2015-08-18 2018-07-04 三菱電機株式会社 半導体装置
CN106252310B (zh) * 2016-06-02 2020-05-05 苏州能讯高能半导体有限公司 半导体器件及其制造方法

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