JPWO2023248670A1 - - Google Patents
Info
- Publication number
- JPWO2023248670A1 JPWO2023248670A1 JP2024528425A JP2024528425A JPWO2023248670A1 JP WO2023248670 A1 JPWO2023248670 A1 JP WO2023248670A1 JP 2024528425 A JP2024528425 A JP 2024528425A JP 2024528425 A JP2024528425 A JP 2024528425A JP WO2023248670 A1 JPWO2023248670 A1 JP WO2023248670A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022100048 | 2022-06-22 | ||
| JP2022100048 | 2022-06-22 | ||
| PCT/JP2023/018941 WO2023248670A1 (ja) | 2022-06-22 | 2023-05-22 | 半導体装置、電力変換装置、および、半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248670A1 true JPWO2023248670A1 (https=) | 2023-12-28 |
| JPWO2023248670A5 JPWO2023248670A5 (https=) | 2024-09-13 |
| JP7789208B2 JP7789208B2 (ja) | 2025-12-19 |
Family
ID=89379721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528425A Active JP7789208B2 (ja) | 2022-06-22 | 2023-05-22 | 半導体装置、電力変換装置、および、半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250273527A1 (https=) |
| JP (1) | JP7789208B2 (https=) |
| CN (1) | CN119384877A (https=) |
| DE (1) | DE112023002719T5 (https=) |
| WO (1) | WO2023248670A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004048639A (ja) * | 2002-05-17 | 2004-02-12 | Murata Mfg Co Ltd | 圧電共振子及びその製造方法等 |
| JP2006351943A (ja) * | 2005-06-17 | 2006-12-28 | Toppan Printing Co Ltd | マイクロ反応チップおよびその製造方法 |
| JP2018117026A (ja) * | 2017-01-17 | 2018-07-26 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2021033664A1 (ja) * | 2019-08-21 | 2021-02-25 | 株式会社村田製作所 | 半導体装置 |
-
2023
- 2023-05-22 JP JP2024528425A patent/JP7789208B2/ja active Active
- 2023-05-22 US US18/859,403 patent/US20250273527A1/en active Pending
- 2023-05-22 CN CN202380047145.4A patent/CN119384877A/zh active Pending
- 2023-05-22 WO PCT/JP2023/018941 patent/WO2023248670A1/ja not_active Ceased
- 2023-05-22 DE DE112023002719.6T patent/DE112023002719T5/de active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004048639A (ja) * | 2002-05-17 | 2004-02-12 | Murata Mfg Co Ltd | 圧電共振子及びその製造方法等 |
| JP2006351943A (ja) * | 2005-06-17 | 2006-12-28 | Toppan Printing Co Ltd | マイクロ反応チップおよびその製造方法 |
| JP2018117026A (ja) * | 2017-01-17 | 2018-07-26 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2021033664A1 (ja) * | 2019-08-21 | 2021-02-25 | 株式会社村田製作所 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7789208B2 (ja) | 2025-12-19 |
| CN119384877A (zh) | 2025-01-28 |
| US20250273527A1 (en) | 2025-08-28 |
| WO2023248670A1 (ja) | 2023-12-28 |
| DE112023002719T5 (de) | 2025-04-17 |
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