JPWO2023167147A5 - - Google Patents

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Publication number
JPWO2023167147A5
JPWO2023167147A5 JP2024504679A JP2024504679A JPWO2023167147A5 JP WO2023167147 A5 JPWO2023167147 A5 JP WO2023167147A5 JP 2024504679 A JP2024504679 A JP 2024504679A JP 2024504679 A JP2024504679 A JP 2024504679A JP WO2023167147 A5 JPWO2023167147 A5 JP WO2023167147A5
Authority
JP
Japan
Prior art keywords
region
silicon carbide
dimension
semiconductor device
carbide semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024504679A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023167147A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/007114 external-priority patent/WO2023167147A1/ja
Publication of JPWO2023167147A1 publication Critical patent/JPWO2023167147A1/ja
Publication of JPWO2023167147A5 publication Critical patent/JPWO2023167147A5/ja
Pending legal-status Critical Current

Links

JP2024504679A 2022-03-04 2023-02-27 Pending JPWO2023167147A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022033297 2022-03-04
PCT/JP2023/007114 WO2023167147A1 (ja) 2022-03-04 2023-02-27 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023167147A1 JPWO2023167147A1 (https=) 2023-09-07
JPWO2023167147A5 true JPWO2023167147A5 (https=) 2024-11-11

Family

ID=87883728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024504679A Pending JPWO2023167147A1 (https=) 2022-03-04 2023-02-27

Country Status (5)

Country Link
US (1) US20250089292A1 (https=)
JP (1) JPWO2023167147A1 (https=)
CN (1) CN118648120A (https=)
DE (1) DE112023001206T5 (https=)
WO (1) WO2023167147A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018088063A1 (ja) * 2016-11-11 2018-05-17 住友電気工業株式会社 炭化珪素半導体装置
JP7243875B2 (ja) 2017-03-02 2023-03-22 株式会社三洋物産 遊技機
JP7067021B2 (ja) * 2017-11-07 2022-05-16 富士電機株式会社 絶縁ゲート型半導体装置及びその製造方法
CN114503283B (zh) * 2019-12-20 2025-11-25 住友电气工业株式会社 碳化硅半导体装置

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