JP2025113483A5 - - Google Patents
Info
- Publication number
- JP2025113483A5 JP2025113483A5 JP2025090369A JP2025090369A JP2025113483A5 JP 2025113483 A5 JP2025113483 A5 JP 2025113483A5 JP 2025090369 A JP2025090369 A JP 2025090369A JP 2025090369 A JP2025090369 A JP 2025090369A JP 2025113483 A5 JP2025113483 A5 JP 2025113483A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- silicon carbide
- conductivity type
- type impurity
- impurity concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025090369A JP7852123B2 (ja) | 2022-03-22 | 2025-05-30 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022045801A JP7691393B2 (ja) | 2022-03-22 | 2022-03-22 | 半導体装置 |
| JP2025090369A JP7852123B2 (ja) | 2022-03-22 | 2025-05-30 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022045801A Division JP7691393B2 (ja) | 2022-03-22 | 2022-03-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2025113483A JP2025113483A (ja) | 2025-08-01 |
| JP2025113483A5 true JP2025113483A5 (https=) | 2025-10-16 |
| JP7852123B2 JP7852123B2 (ja) | 2026-04-27 |
Family
ID=83507430
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022045801A Active JP7691393B2 (ja) | 2022-03-22 | 2022-03-22 | 半導体装置 |
| JP2025090369A Active JP7852123B2 (ja) | 2022-03-22 | 2025-05-30 | 半導体装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022045801A Active JP7691393B2 (ja) | 2022-03-22 | 2022-03-22 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12464794B2 (https=) |
| EP (1) | EP4250371A1 (https=) |
| JP (2) | JP7691393B2 (https=) |
| CN (1) | CN116825840A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024137537A (ja) * | 2023-03-24 | 2024-10-07 | 株式会社東芝 | 半導体装置 |
| US20250113531A1 (en) * | 2023-09-28 | 2025-04-03 | Wolfspeed, Inc. | Power silicon carbide based semiconductor devices with selective jfet implants that are self-aligned with the well regions and methods of making such devices |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3656744B2 (ja) | 2001-11-21 | 2005-06-08 | 株式会社デンソー | 半導体装置 |
| AU2003275541A1 (en) | 2002-10-18 | 2004-05-04 | National Institute Of Advanced Industrial Science And Technology | Silicon carbide semiconductor device and its manufacturing method |
| JP4903439B2 (ja) | 2005-05-31 | 2012-03-28 | 株式会社東芝 | 電界効果トランジスタ |
| JP5789928B2 (ja) * | 2010-08-02 | 2015-10-07 | 富士電機株式会社 | Mos型半導体装置およびその製造方法 |
| JP5597217B2 (ja) | 2012-02-29 | 2014-10-01 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2014146738A (ja) | 2013-01-30 | 2014-08-14 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| CN104584221B (zh) | 2013-02-13 | 2017-04-19 | 富士电机株式会社 | 半导体装置 |
| JP6183087B2 (ja) | 2013-09-13 | 2017-08-23 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| JP6666224B2 (ja) * | 2016-09-21 | 2020-03-13 | 株式会社東芝 | 半導体装置 |
| JP6926869B2 (ja) | 2017-09-13 | 2021-08-25 | 富士電機株式会社 | 半導体装置 |
| JP7078226B2 (ja) | 2018-07-19 | 2022-05-31 | 国立研究開発法人産業技術総合研究所 | 半導体装置 |
| JP7003019B2 (ja) * | 2018-09-15 | 2022-01-20 | 株式会社東芝 | 半導体装置 |
| JP7214508B2 (ja) * | 2019-03-01 | 2023-01-30 | 株式会社東芝 | 半導体装置 |
| WO2020184338A1 (ja) | 2019-03-08 | 2020-09-17 | 株式会社新川 | ワイヤボンディング装置 |
| JP6737379B2 (ja) | 2019-05-31 | 2020-08-05 | 富士電機株式会社 | 半導体装置 |
| JP7439422B2 (ja) | 2019-09-06 | 2024-02-28 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| JP7362546B2 (ja) | 2020-05-14 | 2023-10-17 | 株式会社東芝 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
| JP7593225B2 (ja) * | 2021-05-14 | 2024-12-03 | 株式会社デンソー | 炭化珪素半導体装置 |
-
2022
- 2022-03-22 JP JP2022045801A patent/JP7691393B2/ja active Active
- 2022-07-11 CN CN202210811219.4A patent/CN116825840A/zh active Pending
- 2022-09-07 EP EP22194298.0A patent/EP4250371A1/en active Pending
- 2022-09-08 US US17/940,373 patent/US12464794B2/en active Active
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2025
- 2025-05-30 JP JP2025090369A patent/JP7852123B2/ja active Active