JPWO2023162965A5 - - Google Patents
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- Publication number
- JPWO2023162965A5 JPWO2023162965A5 JP2024503165A JP2024503165A JPWO2023162965A5 JP WO2023162965 A5 JPWO2023162965 A5 JP WO2023162965A5 JP 2024503165 A JP2024503165 A JP 2024503165A JP 2024503165 A JP2024503165 A JP 2024503165A JP WO2023162965 A5 JPWO2023162965 A5 JP WO2023162965A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- region
- insulating layer
- board according
- arithmetic mean
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022029334 | 2022-02-28 | ||
| JP2022029334 | 2022-02-28 | ||
| PCT/JP2023/006187 WO2023162965A1 (ja) | 2022-02-28 | 2023-02-21 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162965A1 JPWO2023162965A1 (https=) | 2023-08-31 |
| JPWO2023162965A5 true JPWO2023162965A5 (https=) | 2024-10-31 |
| JP7778219B2 JP7778219B2 (ja) | 2025-12-01 |
Family
ID=87765907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503165A Active JP7778219B2 (ja) | 2022-02-28 | 2023-02-21 | 配線基板及び実装構造体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250168970A1 (https=) |
| EP (1) | EP4489532A1 (https=) |
| JP (1) | JP7778219B2 (https=) |
| KR (1) | KR20240141302A (https=) |
| CN (1) | CN118765538A (https=) |
| TW (1) | TWI866088B (https=) |
| WO (1) | WO2023162965A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051113A (ja) * | 1996-07-29 | 1998-02-20 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
| JP2007095828A (ja) | 2005-09-27 | 2007-04-12 | Dainippon Printing Co Ltd | パターン形成体 |
| JP5855905B2 (ja) * | 2010-12-16 | 2016-02-09 | 日本特殊陶業株式会社 | 多層配線基板及びその製造方法 |
| JP6380626B1 (ja) * | 2017-07-19 | 2018-08-29 | オムロン株式会社 | 樹脂構造体の製造方法および樹脂構造体 |
| KR102353143B1 (ko) * | 2017-07-24 | 2022-01-18 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 |
| JP6716781B2 (ja) | 2017-12-15 | 2020-07-01 | 積水化学工業株式会社 | 積層フィルム及びプリント配線板用組み合わせ部材 |
| JP2019127571A (ja) | 2018-01-26 | 2019-08-01 | 日立化成株式会社 | 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置 |
| JP2022030289A (ja) | 2020-08-06 | 2022-02-18 | イビデン株式会社 | 配線基板及び配線基板の製造方法 |
-
2023
- 2023-02-21 JP JP2024503165A patent/JP7778219B2/ja active Active
- 2023-02-21 EP EP23759966.7A patent/EP4489532A1/en not_active Withdrawn
- 2023-02-21 WO PCT/JP2023/006187 patent/WO2023162965A1/ja not_active Ceased
- 2023-02-21 KR KR1020247028762A patent/KR20240141302A/ko not_active Withdrawn
- 2023-02-21 US US18/841,569 patent/US20250168970A1/en active Pending
- 2023-02-21 CN CN202380023743.8A patent/CN118765538A/zh not_active Withdrawn
- 2023-02-23 TW TW112106761A patent/TWI866088B/zh active
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