JP5875702B2 - 積層体を備えた電子デバイスの製造方法および電子デバイス - Google Patents
積層体を備えた電子デバイスの製造方法および電子デバイス Download PDFInfo
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Description
Claims (10)
- 積層体(1)を備えた電子デバイスの製造方法であって、
前記電子デバイスは、電界の印加に反応する複数の材料層(2)と、複数の電極層(3、4)とから形成されており、
各材料層(2)は、前記2つの電極層(3、4)の間に配置されており、
・前記積層体(1)の上面および下面上に絶縁構造体(7、8)を形成するステップと、その結果、前記電極層(3、4)は、電気的な接触接続のために一つ置きに露出され、
・前記絶縁構造体(7、8)が設けられている、前記積層体(1)の上面および下面上に接触接続構造体(13、14)を被着するステップと、を有する、電子デバイスの製造方法において、
・前記接触接続構造体(13、14)を形成するステップの前に、少なくとも一つ置きの電極層(3、4)が表面近傍で露出されるように、材料除去方法によって前記材料層(2)を部分的に除去するステップを有し、ここで当該除去後の前記材料層(2)は、前記積層体(1)の長手軸に対して平行に延在し、かつ、前記積層体(1)の上面および下面を垂直に通って延在する断面において、隣接する2つの電極層(3、4)の間に凹状の形を有しており、ここで前記凹状の形とは、前記電極層(3、4)の領域では、前記2つの電極層(3、4)の間の中央部分と比べて、前記材料層(2)の材料の材料除去が少ない形のことである、
ことを特徴とする、電子デバイスの製造方法。 - 前記電極層(3、4)の端面に加えて、前記電極層(3、4)の表面近傍部分が少なくとも部分的に、前記電極層(3、4)の主要面で露出されるように、前記材料層(2)の前記材料除去を行うステップを有する、請求項1記載の方法。
- 前記材料層(2)の部分的な表面近傍の材料除去を、前記絶縁構造体を形成するステップの前に行うステップを有する、請求項1または2記載の方法。
- 前記材料層(2)の部分的な表面近傍の材料除去を、前記絶縁構造体を形成するステップの後に行うステップを有する、請求項1または2記載の方法。
- 電気的な接触接続のための電極層(3、4)の一つ置きの露出と、当該露出領域における前記材料層(2)の材料除去とを同時に行うステップを有する、請求項4記載の方法。
- 一つ置きの電極層(3、4)の前記露出と、前記材料層(2)の材料除去とを、同じ処理方法によって行うステップを有する、請求項4または5記載の方法。
- 前記材料層(2)の部分的な表面近傍の材料除去を、研磨、ブラッシング、ブラストを用いて、またはレーザによって行うステップを有する、請求項1から6までのいずれか1項記載の方法。
- 前記絶縁構造体(7、8)を形成するステップと、前記絶縁構造体(7、8)を形成するステップに続く、前記材料層(2)の材料を部分的に除去するステップとの後に、薄い金属層を、殊にスパッタリングによって前記絶縁構造体(7、8)上に被着するステップを有し、後続のステップにおいて、前記接触接続構造体(13、14)を前記薄い金属層上に被着する、請求項1から7までのいずれか1項記載の方法。
- 積層体(1)を備えた電子デバイスであって、当該電子デバイスは、
・複数の電極層(3、4)と、
・複数の材料層(2)と、
・絶縁構造体(7、8)と、
・接触接続構造体(13、14)と
を有しており、
前記材料層(2)は電界の印加に反応し、各材料層(2)は前記2つの電極層(3、4)の間に配置されており、
前記絶縁構造体(7、8)は、前記積層体(1)の上面および下面上に被着されており、電極層(3、4)が一つ置きに、電気的な接触接続のために露出されるように前記絶縁構造体(7、8)が形成されており、
前記接触接続構造体(13、14)は、前記絶縁構造体(7、8)が設けられている、前記積層体(1)の上面および下面上に被着されている、電子デバイスにおいて、
・前記材料層(2)は、前記積層体(1)の長手軸に対して平行に、かつ、前記積層体(1)の上面および下面を垂直に通る断面において、少なくとも、前記露出された電極層(3、4)に接している表面近傍領域において少なくとも部分的に除去されており、前記絶縁構造体(7、8)または前記接触接続構造体(13、14)の材料によって置き換えられており、ここで当該除去後の前記材料層(2)は、前記積層体(1)の長手軸に対して平行に延在し、かつ、前記積層体(1)の上面および下面を垂直に通って延在する断面において、隣接する2つの電極層(3、4)の間に凹状の形を有しており、ここで前記凹状の形とは、前記電極層(3、4)の領域では、前記2つの電極層(3、4)の間の中央部分と比べて、前記材料層の材料の材料除去が少ない形のことである、
ことを特徴とする電子デバイス。 - 前記接触接続構造体(13、14)の材料は、非導電性材料から成るキャリヤーと、当該キャリヤー内に埋設された金属粒子とを備えた導電性接着剤を含む、請求項9記載の電子デバイス。
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PCT/EP2013/059562 WO2013167643A2 (de) | 2012-05-08 | 2013-05-08 | Verfahren zum elektrischen kontaktieren eines elektronischen bauelements als stapel und elektronisches bauelement mit einer kontaktierungsstruktur |
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DE102012207598A1 (de) * | 2012-05-08 | 2013-11-14 | Continental Automotive Gmbh | Verfahren zum elektrischen Kontaktieren eines elektronischen Bauelements als Stapel und elektronisches Bauelement mit einer Kontaktierungsstruktur |
DE102015214778A1 (de) * | 2015-08-03 | 2017-02-09 | Continental Automotive Gmbh | Herstellungsverfahren zum Herstellen eines elektromechanischen Aktors und elektromechanischer Aktor |
DE102015215204A1 (de) * | 2015-08-10 | 2017-02-16 | Continental Automotive Gmbh | Herstellungsverfahren zum Herstellen eines elektromechanischen Aktors und elektromechanischer Aktor. |
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DE102007058873A1 (de) | 2007-12-06 | 2009-06-10 | Siemens Ag | Piezoelektrisches Bauteil mit Außenkontaktierung, die eine Gasphasen-Abscheidung aufweist, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils |
DE102008049788A1 (de) * | 2008-09-30 | 2010-06-10 | Siemens Aktiengesellschaft | Ultraschallwandler mit mindestens einem vollaktiven, monolithischen Piezoelement, Verfahren zum selektiven Kontaktieren von Innenelektroden des Ultraschallwandlers durch Abtrag von Elektrodenmaterial und Verwendung des Utraschallwandlers |
DE102010022911B4 (de) * | 2010-06-07 | 2017-01-19 | Continental Automotive Gmbh | Verfahren zum Herstellen eines Piezoaktors und Piezoaktor |
DE102012207598A1 (de) | 2012-05-08 | 2013-11-14 | Continental Automotive Gmbh | Verfahren zum elektrischen Kontaktieren eines elektronischen Bauelements als Stapel und elektronisches Bauelement mit einer Kontaktierungsstruktur |
DE102012105287B4 (de) * | 2012-06-18 | 2020-07-02 | Tdk Electronics Ag | Verfahren zur Herstellung eines elektrischen Bauelements und Elektrisches Bauelement |
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2012
- 2012-05-08 DE DE102012207598A patent/DE102012207598A1/de not_active Withdrawn
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2013
- 2013-05-08 WO PCT/EP2013/059562 patent/WO2013167643A2/de active Application Filing
- 2013-05-08 JP JP2014548111A patent/JP5875702B2/ja active Active
- 2013-05-08 EP EP13720962.3A patent/EP2777083B1/de active Active
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US20150048722A1 (en) | 2015-02-19 |
DE102012207598A1 (de) | 2013-11-14 |
WO2013167643A3 (de) | 2014-06-19 |
EP2777083B1 (de) | 2016-01-20 |
JP2015505165A (ja) | 2015-02-16 |
EP2777083A2 (de) | 2014-09-17 |
US9691965B2 (en) | 2017-06-27 |
WO2013167643A2 (de) | 2013-11-14 |
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