JP2015201634A - Mid回路担持体の製造方法およびmid回路担持体 - Google Patents
Mid回路担持体の製造方法およびmid回路担持体 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 238000000608 laser ablation Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- -1 gold ions Chemical class 0.000 claims description 2
- 239000000243 solution Substances 0.000 abstract description 5
- 238000007747 plating Methods 0.000 description 13
- 239000010949 copper Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
2 端子接点(接触領域)
2a 端子接点表面領域
3 射出成形体
4a 回路表面領域
6 導電路
7 基板
8 規定破断個所(規定切り離し個所)
9 ノッチ
12 導線集結部
13 第1の槽
14 接続接点
16 金属核
17 第2の槽
18 第2の金属層
20 電極
21 第1の金属層
106 導電路領域
d ピッチ間隔(導電路の間隔量)
L 導電路の幅
U 電圧
V 電気ポテンシャル
Claims (11)
- MID回路担持体(1)を製造する方法において、以下の少なくとも1つのステップを含み、すなわち、
基板(7)と接触領域(2)とを有する一体の射出成形体(3)を射出成形技術で形成するステップと、
金属核(16)の作用のもとに、前記基板(7)上で回路表面領域(4a)を構造化し、且つ前記接触領域(2)上で端子接点表面領域(2a)を構造化するステップであって、前記回路表面領域(4a)上で、前記接触領域(2)の前記端子接点表面領域(2a)へ延在する導電路領域(106)を構造化させる前記ステップと、
構造化した前記回路表面領域(4a)上と前記端子接点表面領域(2a)上とに第1の金属層(21)を外部電流なしに次のように被着させ、すなわち少なくとも2つの導電路(6)が、前記回路表面領域(4a)から、前記端子接点表面領域(2a)上に形成される少なくとも1つの導線集結部(12)へ延在し、その際前記導電路(6)が前記少なくとも1つの導線集結部(12)を介して互いに接触するように、被着させるステップと、
前記導線集結部(12)に電気ポテンシャル(V)を印加して、前記第1の金属層(21)上に、または、前記第1の金属層(21)とともに、第2の金属層(18)を電気化学的に形成するステップと、
少なくとも前記導線集結部(12)を除去して、前記導電路(6)を電気的に切り離すステップと、
を含んでいる方法。 - 前記基板(7)と前記接触領域(2)との間に規定切り離し個所(8)を形成し、その際複数の前記導電路(6)は前記回路表面領域(4a)から前記規定切り離し個所(8)を経て前記導線集結部(12)へ延在していること、
前記導線集結部(12)を除去する際に前記接触領域(2)を前記規定切り離し個所(8)に沿って前記基板(7)から切り離して前記導電路(6)を切り離すこと、
を特徴とする、請求項1に記載の方法。 - 前記規定切り離し個所(8)が、材料薄肉部を備えるように、たとえばノッチ(9)を備えるように規定破断個所(8)として形成され、前記接触領域(2)を前記導線集結部(12)とともに機械的に切り離し、たとえば曲げによって折り取ることを特徴とする、請求項2に記載の方法。
- 前記接触領域(2)を前記規定切り離し個所(8)においてレーザー切断によって切り離すことを特徴とする、請求項2に記載の方法。
- 前記少なくとも1つの導線集結部(12)を、前記接触領域(2)を切り離すことなしに、たとえばレーザー切除によって除去することを特徴とする、請求項1または2に記載の方法。
- 前記第1の金属層(21)を第1の槽(13)内で、特に銅イオンを含んだ第1の槽(13)内で形成し、前記第2の金属層(18)を第2の槽(17)内で、特に金イオンを含んだ第2の槽(17)内で形成し、その際に前記第2の槽(17)内で使用される電極(20)と前記第1の金属層(21)との間に電圧(U)を印加することを特徴とする、請求項1〜5のいずれか一項に記載の方法。
- 前記接触領域(2)上で、前記少なくとも1つの導線集結部(12)に接続接点(14)が接触しており、該接続接点(14)は、個々の前記導電路(6)よりも大きな横幅(a)を有し、前記第2の金属層(21)を電解被着するための電気接点を設置するために設けられていることを特徴とする、請求項1〜6のいずれか一項に記載の方法。
- 前記射出成形体(3)を形成するプラスチック材料が金属核(16)を有し、該金属核は、レーザー構造化により、特にレーザーダイレクトストラクチャリングにより構造化する際に露出され、前記導電路(6)と前記少なくとも1つの導線集結部(12)と好ましくは前記接続接点(14)とを形成するために設けられていることを特徴とする、請求項1〜7のいずれか一項に記載の方法。
- 請求項1〜8のいずれか一項に記載の方法によって製造可能なMID回路担持体(1)。
- 前記導電路(6)が、第1の金属層(21)と、アクティブな電解めっきによって形成される第2の金属層(18)とを有し、前記導電路(6)が150μm以下の、たとえば100μm以下の間隔量(d)を有していることを特徴とする、請求項9に記載のMID回路担持体(1)。
- 前記導電路(6)が、60μmよりも小さな導電路幅(L)を有していることを特徴とする、請求項10に記載のMID回路担持体(1)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102014206558.5 | 2014-04-04 | ||
DE102014206558.5A DE102014206558A1 (de) | 2014-04-04 | 2014-04-04 | Verfahren zum Herstellen eines MID-Schaltungsträgers und MID-Schaltungsträger |
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JP2015201634A true JP2015201634A (ja) | 2015-11-12 |
JP6646943B2 JP6646943B2 (ja) | 2020-02-14 |
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JP (1) | JP6646943B2 (ja) |
CN (1) | CN104981106A (ja) |
DE (1) | DE102014206558A1 (ja) |
Cited By (1)
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WO2016158117A1 (ja) * | 2015-03-31 | 2016-10-06 | オリンパス株式会社 | 成形回路部品、成形回路部品の製造方法および回路モジュール |
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CN105472901A (zh) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | 一种精细线路镭雕制造工艺 |
CN108702838A (zh) * | 2016-01-20 | 2018-10-23 | 松下知识产权经营株式会社 | 电路基板 |
DE102017201634B3 (de) | 2017-02-01 | 2018-06-14 | Leoni Kabel Gmbh | Strangförmiges Element sowie Verfahren zur Herstellung eines strangförmigen Elements |
CN111497116A (zh) * | 2019-01-31 | 2020-08-07 | 深圳正峰印刷有限公司 | 一种一体化智能表面的注塑结构件的制备方法 |
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JP6646943B2 (ja) | 2020-02-14 |
CN104981106A (zh) | 2015-10-14 |
DE102014206558A1 (de) | 2015-10-08 |
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