CN118765538A - 布线基板 - Google Patents

布线基板 Download PDF

Info

Publication number
CN118765538A
CN118765538A CN202380023743.8A CN202380023743A CN118765538A CN 118765538 A CN118765538 A CN 118765538A CN 202380023743 A CN202380023743 A CN 202380023743A CN 118765538 A CN118765538 A CN 118765538A
Authority
CN
China
Prior art keywords
region
insulating layer
wiring
conductor
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202380023743.8A
Other languages
English (en)
Chinese (zh)
Inventor
清水大地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118765538A publication Critical patent/CN118765538A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
CN202380023743.8A 2022-02-28 2023-02-21 布线基板 Withdrawn CN118765538A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-029334 2022-02-28
JP2022029334 2022-02-28
PCT/JP2023/006187 WO2023162965A1 (ja) 2022-02-28 2023-02-21 配線基板

Publications (1)

Publication Number Publication Date
CN118765538A true CN118765538A (zh) 2024-10-11

Family

ID=87765907

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380023743.8A Withdrawn CN118765538A (zh) 2022-02-28 2023-02-21 布线基板

Country Status (7)

Country Link
US (1) US20250168970A1 (https=)
EP (1) EP4489532A1 (https=)
JP (1) JP7778219B2 (https=)
KR (1) KR20240141302A (https=)
CN (1) CN118765538A (https=)
TW (1) TWI866088B (https=)
WO (1) WO2023162965A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051113A (ja) * 1996-07-29 1998-02-20 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2007095828A (ja) 2005-09-27 2007-04-12 Dainippon Printing Co Ltd パターン形成体
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP6380626B1 (ja) * 2017-07-19 2018-08-29 オムロン株式会社 樹脂構造体の製造方法および樹脂構造体
JP6550196B2 (ja) * 2017-07-24 2019-07-24 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
WO2019117261A1 (ja) 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
JP7778219B2 (ja) 2025-12-01
TW202344156A (zh) 2023-11-01
JPWO2023162965A1 (https=) 2023-08-31
EP4489532A1 (en) 2025-01-08
WO2023162965A1 (ja) 2023-08-31
TWI866088B (zh) 2024-12-11
KR20240141302A (ko) 2024-09-26
US20250168970A1 (en) 2025-05-22

Similar Documents

Publication Publication Date Title
JP6885800B2 (ja) 配線基板およびその製造方法
KR101277980B1 (ko) 다층배선기판
JP2018504776A (ja) プリント回路基板のための高速インターコネクト
CN109729638B (zh) 布线基板
KR20080044174A (ko) 반도체 패키지 및 그 제조방법
KR102078009B1 (ko) 인쇄회로기판 및 그 제조방법
US9655242B2 (en) Printed wiring board
JP2004095854A (ja) 多層配線基板
CN118765538A (zh) 布线基板
US20240422900A1 (en) Wiring board and manufacturing method for the same
CN216087116U (zh) 一种布线板之间的通孔
CN100583424C (zh) 封装基板
TWI889081B (zh) 配線基板及其製造方法
US12388025B2 (en) Wiring substrate
US20230397335A1 (en) Wiring substrate
KR100797669B1 (ko) 인쇄회로기판 및 그 제조방법
JP2003060324A (ja) プリント配線板
US20240049398A1 (en) Wiring substrate and method for manufacturing wiring substrate
JP2024032317A (ja) 配線基板
WO2026028759A1 (ja) 配線基板および実装構造体
TW202327003A (zh) 配線基板
WO2025115582A1 (ja) 配線基板およびその製造方法
CN118338526A (zh) 布线基板
CN116193710A (zh) 布线基板以及布线基板的制造方法
KR20100048114A (ko) 범프기판을 갖는 인쇄회로기판 및 그 제조방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20241011

WW01 Invention patent application withdrawn after publication