JPWO2023162965A1 - - Google Patents

Info

Publication number
JPWO2023162965A1
JPWO2023162965A1 JP2024503165A JP2024503165A JPWO2023162965A1 JP WO2023162965 A1 JPWO2023162965 A1 JP WO2023162965A1 JP 2024503165 A JP2024503165 A JP 2024503165A JP 2024503165 A JP2024503165 A JP 2024503165A JP WO2023162965 A1 JPWO2023162965 A1 JP WO2023162965A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024503165A
Other languages
Japanese (ja)
Other versions
JPWO2023162965A5 (https=
JP7778219B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023162965A1 publication Critical patent/JPWO2023162965A1/ja
Publication of JPWO2023162965A5 publication Critical patent/JPWO2023162965A5/ja
Application granted granted Critical
Publication of JP7778219B2 publication Critical patent/JP7778219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP2024503165A 2022-02-28 2023-02-21 配線基板及び実装構造体 Active JP7778219B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022029334 2022-02-28
JP2022029334 2022-02-28
PCT/JP2023/006187 WO2023162965A1 (ja) 2022-02-28 2023-02-21 配線基板

Publications (3)

Publication Number Publication Date
JPWO2023162965A1 true JPWO2023162965A1 (https=) 2023-08-31
JPWO2023162965A5 JPWO2023162965A5 (https=) 2024-10-31
JP7778219B2 JP7778219B2 (ja) 2025-12-01

Family

ID=87765907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024503165A Active JP7778219B2 (ja) 2022-02-28 2023-02-21 配線基板及び実装構造体

Country Status (7)

Country Link
US (1) US20250168970A1 (https=)
EP (1) EP4489532A1 (https=)
JP (1) JP7778219B2 (https=)
KR (1) KR20240141302A (https=)
CN (1) CN118765538A (https=)
TW (1) TWI866088B (https=)
WO (1) WO2023162965A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117261A1 (ja) * 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) * 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) * 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051113A (ja) * 1996-07-29 1998-02-20 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2007095828A (ja) 2005-09-27 2007-04-12 Dainippon Printing Co Ltd パターン形成体
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP6380626B1 (ja) * 2017-07-19 2018-08-29 オムロン株式会社 樹脂構造体の製造方法および樹脂構造体
KR102353143B1 (ko) * 2017-07-24 2022-01-18 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117261A1 (ja) * 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) * 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) * 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
KR20240141302A (ko) 2024-09-26
JP7778219B2 (ja) 2025-12-01
TW202344156A (zh) 2023-11-01
WO2023162965A1 (ja) 2023-08-31
TWI866088B (zh) 2024-12-11
CN118765538A (zh) 2024-10-11
EP4489532A1 (en) 2025-01-08
US20250168970A1 (en) 2025-05-22

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