JP7778219B2 - 配線基板及び実装構造体 - Google Patents

配線基板及び実装構造体

Info

Publication number
JP7778219B2
JP7778219B2 JP2024503165A JP2024503165A JP7778219B2 JP 7778219 B2 JP7778219 B2 JP 7778219B2 JP 2024503165 A JP2024503165 A JP 2024503165A JP 2024503165 A JP2024503165 A JP 2024503165A JP 7778219 B2 JP7778219 B2 JP 7778219B2
Authority
JP
Japan
Prior art keywords
region
insulating layer
arithmetic mean
wiring
mean roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024503165A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023162965A1 (https=
JPWO2023162965A5 (https=
Inventor
大地 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023162965A1 publication Critical patent/JPWO2023162965A1/ja
Publication of JPWO2023162965A5 publication Critical patent/JPWO2023162965A5/ja
Application granted granted Critical
Publication of JP7778219B2 publication Critical patent/JP7778219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP2024503165A 2022-02-28 2023-02-21 配線基板及び実装構造体 Active JP7778219B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022029334 2022-02-28
JP2022029334 2022-02-28
PCT/JP2023/006187 WO2023162965A1 (ja) 2022-02-28 2023-02-21 配線基板

Publications (3)

Publication Number Publication Date
JPWO2023162965A1 JPWO2023162965A1 (https=) 2023-08-31
JPWO2023162965A5 JPWO2023162965A5 (https=) 2024-10-31
JP7778219B2 true JP7778219B2 (ja) 2025-12-01

Family

ID=87765907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024503165A Active JP7778219B2 (ja) 2022-02-28 2023-02-21 配線基板及び実装構造体

Country Status (7)

Country Link
US (1) US20250168970A1 (https=)
EP (1) EP4489532A1 (https=)
JP (1) JP7778219B2 (https=)
KR (1) KR20240141302A (https=)
CN (1) CN118765538A (https=)
TW (1) TWI866088B (https=)
WO (1) WO2023162965A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117261A1 (ja) 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051113A (ja) * 1996-07-29 1998-02-20 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2007095828A (ja) 2005-09-27 2007-04-12 Dainippon Printing Co Ltd パターン形成体
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP6380626B1 (ja) * 2017-07-19 2018-08-29 オムロン株式会社 樹脂構造体の製造方法および樹脂構造体
JP6550196B2 (ja) * 2017-07-24 2019-07-24 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117261A1 (ja) 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
TW202344156A (zh) 2023-11-01
JPWO2023162965A1 (https=) 2023-08-31
EP4489532A1 (en) 2025-01-08
WO2023162965A1 (ja) 2023-08-31
CN118765538A (zh) 2024-10-11
TWI866088B (zh) 2024-12-11
KR20240141302A (ko) 2024-09-26
US20250168970A1 (en) 2025-05-22

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