TWI866088B - 配線基板及安裝構造體 - Google Patents

配線基板及安裝構造體 Download PDF

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Publication number
TWI866088B
TWI866088B TW112106761A TW112106761A TWI866088B TW I866088 B TWI866088 B TW I866088B TW 112106761 A TW112106761 A TW 112106761A TW 112106761 A TW112106761 A TW 112106761A TW I866088 B TWI866088 B TW I866088B
Authority
TW
Taiwan
Prior art keywords
insulating layer
region
wiring
conductor
wiring substrate
Prior art date
Application number
TW112106761A
Other languages
English (en)
Chinese (zh)
Other versions
TW202344156A (zh
Inventor
清水大地
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202344156A publication Critical patent/TW202344156A/zh
Application granted granted Critical
Publication of TWI866088B publication Critical patent/TWI866088B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW112106761A 2022-02-28 2023-02-23 配線基板及安裝構造體 TWI866088B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-029334 2022-02-28
JP2022029334 2022-02-28

Publications (2)

Publication Number Publication Date
TW202344156A TW202344156A (zh) 2023-11-01
TWI866088B true TWI866088B (zh) 2024-12-11

Family

ID=87765907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112106761A TWI866088B (zh) 2022-02-28 2023-02-23 配線基板及安裝構造體

Country Status (7)

Country Link
US (1) US20250168970A1 (https=)
EP (1) EP4489532A1 (https=)
JP (1) JP7778219B2 (https=)
KR (1) KR20240141302A (https=)
CN (1) CN118765538A (https=)
TW (1) TWI866088B (https=)
WO (1) WO2023162965A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201242452A (en) * 2010-12-16 2012-10-16 Ngk Spark Plug Co Multilayer wiring substrate and method of manufactruing the same
US20210084767A1 (en) * 2017-07-19 2021-03-18 Omron Corporation Method for manufacturing resin structure, and resin structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051113A (ja) * 1996-07-29 1998-02-20 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2007095828A (ja) 2005-09-27 2007-04-12 Dainippon Printing Co Ltd パターン形成体
JP6550196B2 (ja) * 2017-07-24 2019-07-24 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
WO2019117261A1 (ja) 2017-12-15 2019-06-20 積水化学工業株式会社 積層フィルム及びプリント配線板用組み合わせ部材
JP2019127571A (ja) 2018-01-26 2019-08-01 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP2022030289A (ja) 2020-08-06 2022-02-18 イビデン株式会社 配線基板及び配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201242452A (en) * 2010-12-16 2012-10-16 Ngk Spark Plug Co Multilayer wiring substrate and method of manufactruing the same
US20210084767A1 (en) * 2017-07-19 2021-03-18 Omron Corporation Method for manufacturing resin structure, and resin structure

Also Published As

Publication number Publication date
JP7778219B2 (ja) 2025-12-01
TW202344156A (zh) 2023-11-01
JPWO2023162965A1 (https=) 2023-08-31
EP4489532A1 (en) 2025-01-08
WO2023162965A1 (ja) 2023-08-31
CN118765538A (zh) 2024-10-11
KR20240141302A (ko) 2024-09-26
US20250168970A1 (en) 2025-05-22

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