JPWO2023013213A5 - - Google Patents

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Publication number
JPWO2023013213A5
JPWO2023013213A5 JP2023539665A JP2023539665A JPWO2023013213A5 JP WO2023013213 A5 JPWO2023013213 A5 JP WO2023013213A5 JP 2023539665 A JP2023539665 A JP 2023539665A JP 2023539665 A JP2023539665 A JP 2023539665A JP WO2023013213 A5 JPWO2023013213 A5 JP WO2023013213A5
Authority
JP
Japan
Prior art keywords
wiring board
board according
printed wiring
groove
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023539665A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023013213A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/021565 external-priority patent/WO2023013213A1/ja
Publication of JPWO2023013213A1 publication Critical patent/JPWO2023013213A1/ja
Publication of JPWO2023013213A5 publication Critical patent/JPWO2023013213A5/ja
Pending legal-status Critical Current

Links

JP2023539665A 2021-08-06 2022-05-26 Pending JPWO2023013213A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021129871 2021-08-06
PCT/JP2022/021565 WO2023013213A1 (ja) 2021-08-06 2022-05-26 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023013213A1 JPWO2023013213A1 (https=) 2023-02-09
JPWO2023013213A5 true JPWO2023013213A5 (https=) 2024-05-01

Family

ID=85155625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023539665A Pending JPWO2023013213A1 (https=) 2021-08-06 2022-05-26

Country Status (4)

Country Link
US (1) US12538432B2 (https=)
JP (1) JPWO2023013213A1 (https=)
CN (1) CN117751691A (https=)
WO (1) WO2023013213A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048123A1 (ja) * 2024-08-30 2026-03-05 住友電気工業株式会社 プリント配線板およびプリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243390A (ja) 1986-04-15 1987-10-23 キヤノン株式会社 プリント配線板の製造方法
JP2009081212A (ja) 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd プリント配線板の製造方法
JP2009081209A (ja) 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd プリント配線板の製造方法
KR101067207B1 (ko) * 2009-04-16 2011-09-22 삼성전기주식회사 트렌치 기판 및 그 제조방법
CN102986311B (zh) * 2010-07-08 2016-05-04 Lg伊诺特有限公司 印刷电路板及其制造方法
JP2012244009A (ja) 2011-05-20 2012-12-10 Sumitomo Electric Ind Ltd プリント配線板用基板およびプリント配線板用基板の製造方法
JP5594407B2 (ja) 2013-07-24 2014-09-24 富士電機株式会社 半導体装置

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