CN117751691A - 印刷布线板 - Google Patents

印刷布线板 Download PDF

Info

Publication number
CN117751691A
CN117751691A CN202280053943.3A CN202280053943A CN117751691A CN 117751691 A CN117751691 A CN 117751691A CN 202280053943 A CN202280053943 A CN 202280053943A CN 117751691 A CN117751691 A CN 117751691A
Authority
CN
China
Prior art keywords
wiring board
printed wiring
groove
metal particle
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280053943.3A
Other languages
English (en)
Chinese (zh)
Inventor
山本正道
桥爪佳世
冈田一诚
相川健一郎
冈良雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN117751691A publication Critical patent/CN117751691A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202280053943.3A 2021-08-06 2022-05-26 印刷布线板 Pending CN117751691A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-129871 2021-08-06
JP2021129871 2021-08-06
PCT/JP2022/021565 WO2023013213A1 (ja) 2021-08-06 2022-05-26 プリント配線板

Publications (1)

Publication Number Publication Date
CN117751691A true CN117751691A (zh) 2024-03-22

Family

ID=85155625

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280053943.3A Pending CN117751691A (zh) 2021-08-06 2022-05-26 印刷布线板

Country Status (4)

Country Link
US (1) US12538432B2 (https=)
JP (1) JPWO2023013213A1 (https=)
CN (1) CN117751691A (https=)
WO (1) WO2023013213A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048123A1 (ja) * 2024-08-30 2026-03-05 住友電気工業株式会社 プリント配線板およびプリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243390A (ja) 1986-04-15 1987-10-23 キヤノン株式会社 プリント配線板の製造方法
JP2009081212A (ja) 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd プリント配線板の製造方法
JP2009081209A (ja) 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd プリント配線板の製造方法
KR101067207B1 (ko) * 2009-04-16 2011-09-22 삼성전기주식회사 트렌치 기판 및 그 제조방법
CN102986311B (zh) * 2010-07-08 2016-05-04 Lg伊诺特有限公司 印刷电路板及其制造方法
JP2012244009A (ja) 2011-05-20 2012-12-10 Sumitomo Electric Ind Ltd プリント配線板用基板およびプリント配線板用基板の製造方法
JP5594407B2 (ja) 2013-07-24 2014-09-24 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
US20240251508A1 (en) 2024-07-25
WO2023013213A1 (ja) 2023-02-09
JPWO2023013213A1 (https=) 2023-02-09
US12538432B2 (en) 2026-01-27

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