JPWO2023013213A1 - - Google Patents
Info
- Publication number
- JPWO2023013213A1 JPWO2023013213A1 JP2023539665A JP2023539665A JPWO2023013213A1 JP WO2023013213 A1 JPWO2023013213 A1 JP WO2023013213A1 JP 2023539665 A JP2023539665 A JP 2023539665A JP 2023539665 A JP2023539665 A JP 2023539665A JP WO2023013213 A1 JPWO2023013213 A1 JP WO2023013213A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021129871 | 2021-08-06 | ||
| PCT/JP2022/021565 WO2023013213A1 (ja) | 2021-08-06 | 2022-05-26 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023013213A1 true JPWO2023013213A1 (https=) | 2023-02-09 |
| JPWO2023013213A5 JPWO2023013213A5 (https=) | 2024-05-01 |
Family
ID=85155625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023539665A Pending JPWO2023013213A1 (https=) | 2021-08-06 | 2022-05-26 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12538432B2 (https=) |
| JP (1) | JPWO2023013213A1 (https=) |
| CN (1) | CN117751691A (https=) |
| WO (1) | WO2023013213A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048123A1 (ja) * | 2024-08-30 | 2026-03-05 | 住友電気工業株式会社 | プリント配線板およびプリント配線板の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62243390A (ja) | 1986-04-15 | 1987-10-23 | キヤノン株式会社 | プリント配線板の製造方法 |
| JP2009081212A (ja) | 2007-09-25 | 2009-04-16 | Panasonic Electric Works Co Ltd | プリント配線板の製造方法 |
| JP2009081209A (ja) | 2007-09-25 | 2009-04-16 | Panasonic Electric Works Co Ltd | プリント配線板の製造方法 |
| KR101067207B1 (ko) * | 2009-04-16 | 2011-09-22 | 삼성전기주식회사 | 트렌치 기판 및 그 제조방법 |
| CN102986311B (zh) * | 2010-07-08 | 2016-05-04 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
| JP2012244009A (ja) | 2011-05-20 | 2012-12-10 | Sumitomo Electric Ind Ltd | プリント配線板用基板およびプリント配線板用基板の製造方法 |
| JP5594407B2 (ja) | 2013-07-24 | 2014-09-24 | 富士電機株式会社 | 半導体装置 |
-
2022
- 2022-05-26 JP JP2023539665A patent/JPWO2023013213A1/ja active Pending
- 2022-05-26 US US18/681,035 patent/US12538432B2/en active Active
- 2022-05-26 WO PCT/JP2022/021565 patent/WO2023013213A1/ja not_active Ceased
- 2022-05-26 CN CN202280053943.3A patent/CN117751691A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240251508A1 (en) | 2024-07-25 |
| WO2023013213A1 (ja) | 2023-02-09 |
| CN117751691A (zh) | 2024-03-22 |
| US12538432B2 (en) | 2026-01-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240119 |