JPWO2021234875A5 - - Google Patents

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Publication number
JPWO2021234875A5
JPWO2021234875A5 JP2022524774A JP2022524774A JPWO2021234875A5 JP WO2021234875 A5 JPWO2021234875 A5 JP WO2021234875A5 JP 2022524774 A JP2022524774 A JP 2022524774A JP 2022524774 A JP2022524774 A JP 2022524774A JP WO2021234875 A5 JPWO2021234875 A5 JP WO2021234875A5
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JP
Japan
Prior art keywords
copper
copper foil
layer
conductive layer
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022524774A
Other languages
English (en)
Japanese (ja)
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JPWO2021234875A1 (https=
JP7427776B2 (ja
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Priority claimed from PCT/JP2020/020002 external-priority patent/WO2021234875A1/ja
Publication of JPWO2021234875A1 publication Critical patent/JPWO2021234875A1/ja
Publication of JPWO2021234875A5 publication Critical patent/JPWO2021234875A5/ja
Application granted granted Critical
Publication of JP7427776B2 publication Critical patent/JP7427776B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022524774A 2020-05-20 2020-05-20 プリント配線板 Active JP7427776B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/020002 WO2021234875A1 (ja) 2020-05-20 2020-05-20 プリント配線板

Publications (3)

Publication Number Publication Date
JPWO2021234875A1 JPWO2021234875A1 (https=) 2021-11-25
JPWO2021234875A5 true JPWO2021234875A5 (https=) 2023-02-15
JP7427776B2 JP7427776B2 (ja) 2024-02-05

Family

ID=78708260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524774A Active JP7427776B2 (ja) 2020-05-20 2020-05-20 プリント配線板

Country Status (4)

Country Link
US (1) US12177973B2 (https=)
JP (1) JP7427776B2 (https=)
CN (1) CN115605636B (https=)
WO (1) WO2021234875A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4391741B1 (en) * 2022-12-22 2026-02-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Glass barrier layer product, and manufacture method
WO2025114130A1 (en) * 2023-11-29 2025-06-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft A component carrier assembly and method for manufacturing a component carrier assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3152633B2 (ja) 1996-12-19 2001-04-03 イビデン株式会社 多層プリント配線板およびその製造方法
JP4282134B2 (ja) 1999-02-25 2009-06-17 イビデン株式会社 プリント配線板の製造方法
JP2003209330A (ja) 2002-01-15 2003-07-25 Ube Ind Ltd 両面回路基板及びその製造方法
JP2004214410A (ja) 2002-12-27 2004-07-29 Ykc:Kk 多層配線基板の製造方法及び多層配線基板
JP4704474B2 (ja) * 2006-10-24 2011-06-15 Ｊｘ日鉱日石金属株式会社 耐屈曲性に優れた圧延銅箔
JP5051443B2 (ja) * 2007-09-14 2012-10-17 日立化成工業株式会社 多層配線基板の製造方法
JP6350064B2 (ja) * 2013-10-09 2018-07-04 日立化成株式会社 多層配線基板の製造方法
CN113811641B (zh) * 2019-05-15 2023-12-05 住友电气工业株式会社 印刷布线板

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