JPWO2022230220A5 - - Google Patents
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- Publication number
- JPWO2022230220A5 JPWO2022230220A5 JP2023517029A JP2023517029A JPWO2022230220A5 JP WO2022230220 A5 JPWO2022230220 A5 JP WO2022230220A5 JP 2023517029 A JP2023517029 A JP 2023517029A JP 2023517029 A JP2023517029 A JP 2023517029A JP WO2022230220 A5 JPWO2022230220 A5 JP WO2022230220A5
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- metal layer
- terms
- magnesium
- ceramic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 85
- 229910052751 metal Inorganic materials 0.000 claims description 78
- 239000002184 metal Substances 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 26
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 19
- 229910052748 manganese Inorganic materials 0.000 claims description 19
- 239000011572 manganese Substances 0.000 claims description 19
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 15
- 229910052749 magnesium Inorganic materials 0.000 claims description 15
- 239000011777 magnesium Substances 0.000 claims description 15
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 12
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 12
- 239000000395 magnesium oxide Substances 0.000 claims description 11
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 11
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 239000011734 sodium Substances 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229910052708 sodium Inorganic materials 0.000 description 7
- 238000006722 reduction reaction Methods 0.000 description 6
- 229910001415 sodium ion Inorganic materials 0.000 description 6
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- -1 oxygen ions Chemical class 0.000 description 5
- 229910000873 Beta-alumina solid electrolyte Inorganic materials 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 229910002480 Cu-O Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000009279 wet oxidation reaction Methods 0.000 description 4
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 3
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 3
- 229910001948 sodium oxide Inorganic materials 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021075538 | 2021-04-28 | ||
| JP2021075538 | 2021-04-28 | ||
| PCT/JP2021/040282 WO2022230220A1 (ja) | 2021-04-28 | 2021-11-01 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230220A1 JPWO2022230220A1 (https=) | 2022-11-03 |
| JPWO2022230220A5 true JPWO2022230220A5 (https=) | 2023-06-27 |
| JP7589807B2 JP7589807B2 (ja) | 2024-11-26 |
Family
ID=83846864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517029A Active JP7589807B2 (ja) | 2021-04-28 | 2021-11-01 | 半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12525504B2 (https=) |
| JP (1) | JP7589807B2 (https=) |
| KR (1) | KR102823564B1 (https=) |
| CN (1) | CN116250079A (https=) |
| DE (1) | DE112021004170T5 (https=) |
| WO (1) | WO2022230220A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7644899B2 (ja) * | 2021-03-24 | 2025-03-13 | 富士電機株式会社 | 半導体装置 |
| DE102022134661A1 (de) * | 2022-12-23 | 2024-07-04 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats, Keramikelement sowie Metallschicht für ein solches Verfahren und Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58145669A (ja) | 1982-02-18 | 1983-08-30 | 株式会社明電舎 | セラミツクスと銅の接合方法 |
| US4500383A (en) | 1982-02-18 | 1985-02-19 | Kabushiki Kaisha Meidensha | Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
| JPS5939779A (ja) | 1982-08-25 | 1984-03-05 | 住友特殊金属株式会社 | セラミックスと金属の結合方法 |
| JPS6483512A (en) | 1987-09-24 | 1989-03-29 | Showa Denko Kk | Low soda alumina |
| JPH04293290A (ja) | 1991-03-20 | 1992-10-16 | Kyocera Corp | 平滑セラミック基板およびその製造方法 |
| JPH05330958A (ja) | 1992-05-27 | 1993-12-14 | Okuno Chem Ind Co Ltd | メタライズ下地層形成用ガラス組成物 |
| JP3495052B2 (ja) | 1992-07-15 | 2004-02-09 | 株式会社東芝 | メタライズ体およびその製造方法 |
| JPH06172021A (ja) | 1992-12-04 | 1994-06-21 | Sumitomo Metal Mining Co Ltd | 高電圧厚膜回路用アルミナ基板 |
| JP3036367B2 (ja) | 1994-08-19 | 2000-04-24 | 住友金属工業株式会社 | アルミナ磁器組成物 |
| JP3127754B2 (ja) | 1995-01-19 | 2001-01-29 | 富士電機株式会社 | 半導体装置 |
| JP3176815B2 (ja) * | 1995-01-19 | 2001-06-18 | 富士電機株式会社 | 半導体装置用基板 |
| JP2000031325A (ja) | 1998-07-13 | 2000-01-28 | Hitachi Ltd | 半導体パワーモジュール及びこれを用いたインバータ装置 |
| JP3833410B2 (ja) | 1999-03-26 | 2006-10-11 | 株式会社東芝 | セラミックス回路基板 |
| JP3929660B2 (ja) | 1999-10-29 | 2007-06-13 | 京セラ株式会社 | 絶縁性アルミナ質基板およびアルミナ質銅貼回路基板 |
| JP2004047913A (ja) | 2002-07-16 | 2004-02-12 | Sumitomo Metal Electronics Devices Inc | 半導体モジュール用基板 |
| DE102005007373B4 (de) | 2005-02-17 | 2013-05-29 | Infineon Technologies Ag | Leistungshalbleiterbaugruppe |
| JP2006298703A (ja) | 2005-04-21 | 2006-11-02 | Nishimura Togyo Kk | 陶磁器熱放射性固体物 |
| JP2006199584A (ja) | 2006-02-17 | 2006-08-03 | Toshiba Corp | セラミックス回路基板の製造方法 |
| JP5473407B2 (ja) | 2008-06-27 | 2014-04-16 | 京セラ株式会社 | セラミック基板、放熱基板および電子装置 |
| KR101757648B1 (ko) | 2009-04-03 | 2017-07-14 | 가부시키가이샤 스미토모 긴조쿠 엘렉트로 디바이스 | 세라믹스 소결체 및 이를 사용한 반도체장치용 기판 |
| JP5697363B2 (ja) | 2010-05-20 | 2015-04-08 | Ｎｇｋエレクトロデバイス株式会社 | セラミック焼結体およびその製造方法および光反射体および発光素子収納用パッケージ |
| JP5972875B2 (ja) | 2011-07-14 | 2016-08-17 | 株式会社東芝 | セラミックス回路基板 |
| JP6129738B2 (ja) | 2011-07-14 | 2017-05-17 | 株式会社東芝 | セラミックス回路基板 |
| JP5910166B2 (ja) | 2012-02-29 | 2016-04-27 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP6096094B2 (ja) | 2013-10-28 | 2017-03-15 | 日本発條株式会社 | 積層体、絶縁性冷却板、パワーモジュールおよび積層体の製造方法 |
| JP6213993B2 (ja) | 2014-01-21 | 2017-10-18 | Ｎｇｋエレクトロデバイス株式会社 | 電子部品実装用基板 |
| JP2015224151A (ja) | 2014-05-27 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
| JP6711001B2 (ja) | 2016-02-17 | 2020-06-17 | 富士電機株式会社 | 半導体装置及び製造方法 |
| JP7192451B2 (ja) | 2018-01-25 | 2022-12-20 | 三菱マテリアル株式会社 | 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
| JP6963185B2 (ja) | 2018-08-22 | 2021-11-05 | 日本電信電話株式会社 | 帯域割当装置、帯域割当方法及び帯域割当プログラム |
| WO2020044593A1 (ja) * | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法 |
| WO2020044590A1 (ja) | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法 |
| JP7062087B2 (ja) * | 2018-12-06 | 2022-05-02 | 日本碍子株式会社 | セラミックス焼結体及び半導体装置用基板 |
| JP7347047B2 (ja) * | 2019-09-12 | 2023-09-20 | 富士電機株式会社 | 半導体装置 |
| JP6808801B2 (ja) * | 2019-10-08 | 2021-01-06 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
-
2021
- 2021-11-01 DE DE112021004170.3T patent/DE112021004170T5/de active Pending
- 2021-11-01 KR KR1020237010993A patent/KR102823564B1/ko active Active
- 2021-11-01 CN CN202180065550.XA patent/CN116250079A/zh active Pending
- 2021-11-01 JP JP2023517029A patent/JP7589807B2/ja active Active
- 2021-11-01 WO PCT/JP2021/040282 patent/WO2022230220A1/ja not_active Ceased
-
2023
- 2023-03-30 US US18/193,603 patent/US12525504B2/en active Active
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