JPWO2021181192A5 - - Google Patents
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- Publication number
- JPWO2021181192A5 JPWO2021181192A5 JP2022506559A JP2022506559A JPWO2021181192A5 JP WO2021181192 A5 JPWO2021181192 A5 JP WO2021181192A5 JP 2022506559 A JP2022506559 A JP 2022506559A JP 2022506559 A JP2022506559 A JP 2022506559A JP WO2021181192 A5 JPWO2021181192 A5 JP WO2021181192A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- semiconductor chip
- wiring layer
- semiconductor
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025163436A JP2026004414A (ja) | 2020-03-13 | 2025-09-30 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020044668 | 2020-03-13 | ||
| PCT/IB2021/051671 WO2021181192A1 (ja) | 2020-03-13 | 2021-03-01 | 半導体装置、及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025163436A Division JP2026004414A (ja) | 2020-03-13 | 2025-09-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021181192A1 JPWO2021181192A1 (https=) | 2021-09-16 |
| JPWO2021181192A5 true JPWO2021181192A5 (https=) | 2024-02-21 |
Family
ID=77672306
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022506559A Withdrawn JPWO2021181192A1 (https=) | 2020-03-13 | 2021-03-01 | |
| JP2025163436A Pending JP2026004414A (ja) | 2020-03-13 | 2025-09-30 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025163436A Pending JP2026004414A (ja) | 2020-03-13 | 2025-09-30 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12525576B2 (https=) |
| JP (2) | JPWO2021181192A1 (https=) |
| KR (1) | KR20220154675A (https=) |
| CN (1) | CN115053344A (https=) |
| WO (1) | WO2021181192A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7359754B2 (ja) * | 2018-04-20 | 2023-10-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN115349169A (zh) | 2020-03-27 | 2022-11-15 | 株式会社半导体能源研究所 | 存储装置及电子设备 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5183949B2 (ja) | 2007-03-30 | 2013-04-17 | 日本電気株式会社 | 半導体装置の製造方法 |
| KR101591613B1 (ko) * | 2009-10-21 | 2016-02-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5272254B2 (ja) | 2009-12-25 | 2013-08-28 | 邦彦 公山 | 差動リング発振器型電圧制御発振器 |
| US8866301B2 (en) * | 2010-05-18 | 2014-10-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package systems having interposers with interconnection structures |
| JP5848679B2 (ja) | 2012-09-04 | 2016-01-27 | ルネサスエレクトロニクス株式会社 | 差動出力回路および半導体装置 |
| JP6127759B2 (ja) | 2013-06-14 | 2017-05-17 | 富士通株式会社 | 伝送回路および出力回路 |
| JP6259737B2 (ja) | 2014-03-14 | 2018-01-10 | 東芝メモリ株式会社 | 半導体装置及びその製造方法 |
| TWI616979B (zh) | 2014-03-14 | 2018-03-01 | Toshiba Memory Corporation | 半導體裝置及其製造方法 |
| US10199337B2 (en) | 2015-05-11 | 2019-02-05 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and method of manufacturing the same |
| KR20160132751A (ko) | 2015-05-11 | 2016-11-21 | 삼성전기주식회사 | 전자부품 패키지 및 그 제조방법 |
| US9984979B2 (en) | 2015-05-11 | 2018-05-29 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package and method of manufacturing the same |
| US9911756B2 (en) | 2015-08-31 | 2018-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including transistor and electronic device surrounded by layer having assigned band gap to prevent electrostatic discharge damage |
| CN109565277B (zh) | 2016-08-30 | 2024-03-22 | 株式会社半导体能源研究所 | 接收差分信号的接收器、包括接收器的ic以及显示装置 |
| KR102440119B1 (ko) | 2017-08-10 | 2022-09-05 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
| JP7359754B2 (ja) | 2018-04-20 | 2023-10-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7514227B2 (ja) | 2019-05-31 | 2024-07-10 | 株式会社半導体エネルギー研究所 | ミキサ、及び半導体装置 |
| WO2021046744A1 (en) * | 2019-09-11 | 2021-03-18 | Yangtze Memory Technologies Co., Ltd. | Bonded semiconductor devices having processor and static random-access memory and methods for forming the same |
| US12363991B2 (en) | 2020-02-07 | 2025-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and imaging device |
| JP7595057B2 (ja) | 2020-02-21 | 2024-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置、及び電子機器 |
-
2021
- 2021-03-01 JP JP2022506559A patent/JPWO2021181192A1/ja not_active Withdrawn
- 2021-03-01 CN CN202180013072.8A patent/CN115053344A/zh active Pending
- 2021-03-01 KR KR1020227028780A patent/KR20220154675A/ko active Pending
- 2021-03-01 WO PCT/IB2021/051671 patent/WO2021181192A1/ja not_active Ceased
- 2021-03-01 US US17/797,233 patent/US12525576B2/en active Active
-
2025
- 2025-09-30 JP JP2025163436A patent/JP2026004414A/ja active Pending
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