JPWO2021064503A5 - - Google Patents

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Publication number
JPWO2021064503A5
JPWO2021064503A5 JP2021550714A JP2021550714A JPWO2021064503A5 JP WO2021064503 A5 JPWO2021064503 A5 JP WO2021064503A5 JP 2021550714 A JP2021550714 A JP 2021550714A JP 2021550714 A JP2021550714 A JP 2021550714A JP WO2021064503 A5 JPWO2021064503 A5 JP WO2021064503A5
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JP
Japan
Prior art keywords
oxide
conductor
insulator
semiconductor device
region
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JP2021550714A
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English (en)
Japanese (ja)
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JPWO2021064503A1 (https=
JP7568633B2 (ja
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Priority claimed from PCT/IB2020/058699 external-priority patent/WO2021064503A1/ja
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Publication of JPWO2021064503A5 publication Critical patent/JPWO2021064503A5/ja
Priority to JP2024174205A priority Critical patent/JP2024177392A/ja
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Publication of JP7568633B2 publication Critical patent/JP7568633B2/ja
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JP2021550714A 2019-10-04 2020-09-18 半導体装置 Active JP7568633B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024174205A JP2024177392A (ja) 2019-10-04 2024-10-03 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019183530 2019-10-04
JP2019183530 2019-10-04
PCT/IB2020/058699 WO2021064503A1 (ja) 2019-10-04 2020-09-18 半導体装置

Related Child Applications (1)

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JP2024174205A Division JP2024177392A (ja) 2019-10-04 2024-10-03 半導体装置

Publications (3)

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JPWO2021064503A1 JPWO2021064503A1 (https=) 2021-04-08
JPWO2021064503A5 true JPWO2021064503A5 (https=) 2023-09-11
JP7568633B2 JP7568633B2 (ja) 2024-10-16

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JP2021550714A Active JP7568633B2 (ja) 2019-10-04 2020-09-18 半導体装置
JP2024174205A Withdrawn JP2024177392A (ja) 2019-10-04 2024-10-03 半導体装置

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JP2024174205A Withdrawn JP2024177392A (ja) 2019-10-04 2024-10-03 半導体装置

Country Status (3)

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US (1) US12369356B2 (https=)
JP (2) JP7568633B2 (https=)
WO (1) WO2021064503A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115244713A (zh) 2020-03-31 2022-10-25 株式会社半导体能源研究所 半导体装置、半导体装置的制造方法
US20240413247A1 (en) * 2023-06-06 2024-12-12 Taiwan Semiconductor Manufacturing Company Limited Compositionally-modulated capping layer for a transistor and methods for forming the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101870119B1 (ko) 2009-12-25 2018-06-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20120130763A (ko) 2010-02-05 2012-12-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
CN107947763B (zh) 2010-08-06 2021-12-28 株式会社半导体能源研究所 半导体集成电路
TWI632688B (zh) 2013-07-25 2018-08-11 半導體能源研究所股份有限公司 半導體裝置以及半導體裝置的製造方法
US9455337B2 (en) 2014-06-18 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10147747B2 (en) 2014-08-21 2018-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and electronic device
JP6705663B2 (ja) * 2015-03-06 2020-06-03 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
CN104992981B (zh) 2015-05-26 2018-03-06 中国科学院宁波材料技术与工程研究所 氧化物薄膜晶体管及其制备方法和反相器及其制备方法
KR20170112945A (ko) 2016-04-01 2017-10-12 삼성전자주식회사 이동통신 시스템에서 기기 간 통신과 셀룰라 통신의 공존 방법 및 장치
TW202129783A (zh) * 2016-08-24 2021-08-01 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
US20200227562A1 (en) 2017-08-04 2020-07-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
CN111052396B (zh) 2017-09-01 2024-03-01 株式会社半导体能源研究所 半导体装置及显示装置
WO2020070580A1 (ja) 2018-10-05 2020-04-09 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
WO2020075022A1 (ja) 2018-10-12 2020-04-16 株式会社半導体エネルギー研究所 トランジスタ、半導体装置、および電子機器
JP7512204B2 (ja) 2018-10-26 2024-07-08 株式会社半導体エネルギー研究所 金属酸化物の作製方法

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