JPWO2021024071A5 - - Google Patents

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Publication number
JPWO2021024071A5
JPWO2021024071A5 JP2021538508A JP2021538508A JPWO2021024071A5 JP WO2021024071 A5 JPWO2021024071 A5 JP WO2021024071A5 JP 2021538508 A JP2021538508 A JP 2021538508A JP 2021538508 A JP2021538508 A JP 2021538508A JP WO2021024071 A5 JPWO2021024071 A5 JP WO2021024071A5
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JP
Japan
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insulator
semiconductor
conductor
region
storage device
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JP2021538508A
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English (en)
Japanese (ja)
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JPWO2021024071A1 (https=
JP7617003B2 (ja
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Priority claimed from PCT/IB2020/056864 external-priority patent/WO2021024071A1/ja
Publication of JPWO2021024071A1 publication Critical patent/JPWO2021024071A1/ja
Publication of JPWO2021024071A5 publication Critical patent/JPWO2021024071A5/ja
Priority to JP2025001916A priority Critical patent/JP7829073B2/ja
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Publication of JP7617003B2 publication Critical patent/JP7617003B2/ja
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JP2021538508A 2019-08-02 2020-07-22 記憶装置 Active JP7617003B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025001916A JP7829073B2 (ja) 2019-08-02 2025-01-06 記憶装置

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2019143203 2019-08-02
JP2019143203 2019-08-02
JP2019152617 2019-08-23
JP2019152617 2019-08-23
JP2019220338 2019-12-05
JP2019220338 2019-12-05
JP2019230220 2019-12-20
JP2019230220 2019-12-20
PCT/IB2020/056864 WO2021024071A1 (ja) 2019-08-02 2020-07-22 記憶装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025001916A Division JP7829073B2 (ja) 2019-08-02 2025-01-06 記憶装置

Publications (3)

Publication Number Publication Date
JPWO2021024071A1 JPWO2021024071A1 (https=) 2021-02-11
JPWO2021024071A5 true JPWO2021024071A5 (https=) 2023-07-13
JP7617003B2 JP7617003B2 (ja) 2025-01-17

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ID=74503333

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JP2021538508A Active JP7617003B2 (ja) 2019-08-02 2020-07-22 記憶装置
JP2025001916A Active JP7829073B2 (ja) 2019-08-02 2025-01-06 記憶装置

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JP2025001916A Active JP7829073B2 (ja) 2019-08-02 2025-01-06 記憶装置

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US (2) US12347491B2 (https=)
JP (2) JP7617003B2 (https=)
WO (1) WO2021024071A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116368602A (zh) 2020-10-02 2023-06-30 株式会社半导体能源研究所 半导体装置
JP2022146030A (ja) * 2021-03-22 2022-10-05 キオクシア株式会社 半導体記憶装置及びその製造方法
KR20240093546A (ko) 2021-10-27 2024-06-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
JP2024001641A (ja) * 2022-06-22 2024-01-10 キオクシア株式会社 半導体装置及びその製造方法
KR20240032551A (ko) * 2022-09-02 2024-03-12 삼성전자주식회사 수직구조 트랜지스터 및 제조방법
CN119947080B (zh) * 2023-11-02 2026-04-03 北京超弦存储器研究院 一种半导体器件及其制造方法、电子设备

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US6156620A (en) 1998-07-22 2000-12-05 Lsi Logic Corporation Isolation trench in semiconductor substrate with nitrogen-containing barrier region, and process for forming same
US20090282763A1 (en) 2008-05-19 2009-11-19 Samuel Joseph Ferguson Structural building component having a decorative overmolding, apparatus for fabricating such an article and its method of manufacture
KR101698193B1 (ko) 2009-09-15 2017-01-19 삼성전자주식회사 3차원 반도체 메모리 장치 및 그 제조 방법
US8802493B2 (en) 2011-09-13 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of oxide semiconductor device
US20160079265A1 (en) * 2014-09-12 2016-03-17 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device and method of manufacturing the same
JP6509514B2 (ja) * 2014-09-17 2019-05-08 東芝メモリ株式会社 不揮発性半導体記憶装置及びその製造方法
US9711522B2 (en) 2014-10-03 2017-07-18 Sandisk Technologies Llc Memory hole structure in three dimensional memory
US9634097B2 (en) 2014-11-25 2017-04-25 Sandisk Technologies Llc 3D NAND with oxide semiconductor channel
JP6343256B2 (ja) * 2015-05-29 2018-06-13 東芝メモリ株式会社 半導体装置及びその製造方法
JP6400536B2 (ja) 2015-08-04 2018-10-03 東芝メモリ株式会社 半導体記憶装置
US20170062456A1 (en) 2015-08-31 2017-03-02 Cypress Semiconductor Corporation Vertical division of three-dimensional memory device
US10497712B2 (en) * 2017-03-16 2019-12-03 Toshiba Memory Corporation Semiconductor memory
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US10553601B2 (en) * 2017-03-16 2020-02-04 Toshiba Memory Corporation Semiconductor memory including semiconductor oxide
JP6956525B2 (ja) 2017-06-08 2021-11-02 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
JP6693907B2 (ja) * 2017-06-08 2020-05-13 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
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JP7195068B2 (ja) 2017-06-26 2022-12-23 株式会社半導体エネルギー研究所 半導体装置、電子機器
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