JPWO2020136464A5 - - Google Patents

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Publication number
JPWO2020136464A5
JPWO2020136464A5 JP2020561966A JP2020561966A JPWO2020136464A5 JP WO2020136464 A5 JPWO2020136464 A5 JP WO2020136464A5 JP 2020561966 A JP2020561966 A JP 2020561966A JP 2020561966 A JP2020561966 A JP 2020561966A JP WO2020136464 A5 JPWO2020136464 A5 JP WO2020136464A5
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JP
Japan
Prior art keywords
memory device
oxide semiconductor
conductor
semiconductor
insulator
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Application number
JP2020561966A
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English (en)
Japanese (ja)
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JPWO2020136464A1 (https=
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Application filed filed Critical
Priority claimed from PCT/IB2019/059811 external-priority patent/WO2020136464A1/ja
Publication of JPWO2020136464A1 publication Critical patent/JPWO2020136464A1/ja
Publication of JPWO2020136464A5 publication Critical patent/JPWO2020136464A5/ja
Priority to JP2024145948A priority Critical patent/JP7789867B2/ja
Withdrawn legal-status Critical Current

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JP2020561966A 2018-12-28 2019-11-15 Withdrawn JPWO2020136464A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024145948A JP7789867B2 (ja) 2018-12-28 2024-08-27 メモリデバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018248460 2018-12-28
PCT/IB2019/059811 WO2020136464A1 (ja) 2018-12-28 2019-11-15 メモリデバイス、当該メモリデバイスを有する半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024145948A Division JP7789867B2 (ja) 2018-12-28 2024-08-27 メモリデバイス

Publications (2)

Publication Number Publication Date
JPWO2020136464A1 JPWO2020136464A1 (https=) 2020-07-02
JPWO2020136464A5 true JPWO2020136464A5 (https=) 2022-10-14

Family

ID=71126903

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020561966A Withdrawn JPWO2020136464A1 (https=) 2018-12-28 2019-11-15
JP2024145948A Active JP7789867B2 (ja) 2018-12-28 2024-08-27 メモリデバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024145948A Active JP7789867B2 (ja) 2018-12-28 2024-08-27 メモリデバイス

Country Status (5)

Country Link
US (1) US12063770B2 (https=)
JP (2) JPWO2020136464A1 (https=)
KR (1) KR102923216B1 (https=)
TW (1) TWI861028B (https=)
WO (1) WO2020136464A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11271036B2 (en) * 2020-06-24 2022-03-08 Sandisk Technologies Llc Memory device containing dual etch stop layers for selector elements and method of making the same
DE102021122723A1 (de) 2020-09-03 2022-03-03 Lg Display Co., Ltd. Anzeigevorrichtung
US12113115B2 (en) 2021-02-09 2024-10-08 Taiwan Semiconductor Manufacturing Company Limited Thin film transistor including a compositionally-graded gate dielectric and methods for forming the same
US11984508B2 (en) * 2021-02-24 2024-05-14 Taiwan Semiconductor Manufacturing Company Limited Thin film transistor including a compositionally-modulated active region and methods for forming the same
JP2023136275A (ja) * 2022-03-16 2023-09-29 キオクシア株式会社 半導体装置及び半導体記憶装置
JP2023180895A (ja) 2022-06-10 2023-12-21 キオクシア株式会社 半導体装置及び半導体記憶装置
WO2025032474A1 (ja) * 2023-08-10 2025-02-13 株式会社半導体エネルギー研究所 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140772A (ja) 1997-07-22 1999-02-12 Mitsubishi Electric Corp 半導体装置及びその製造方法
US7898893B2 (en) * 2007-09-12 2011-03-01 Samsung Electronics Co., Ltd. Multi-layered memory devices
US9691772B2 (en) 2011-03-03 2017-06-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device including memory cell which includes transistor and capacitor
JP6105266B2 (ja) 2011-12-15 2017-03-29 株式会社半導体エネルギー研究所 記憶装置
KR102207028B1 (ko) * 2012-12-03 2021-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2017006207A1 (en) * 2015-07-08 2017-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9773919B2 (en) * 2015-08-26 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2017158465A1 (ja) * 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 記憶装置
WO2017187301A1 (en) * 2016-04-28 2017-11-02 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device, and electronic device
KR102330605B1 (ko) * 2016-06-22 2021-11-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US10615187B2 (en) * 2016-07-27 2020-04-07 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device, and electronic device
US10504925B2 (en) * 2016-08-08 2019-12-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
CN109791950A (zh) * 2016-10-21 2019-05-21 株式会社半导体能源研究所 半导体装置
WO2018167601A1 (ja) 2017-03-13 2018-09-20 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
CN110402497B (zh) 2017-03-29 2024-08-06 株式会社半导体能源研究所 半导体装置、半导体装置的制造方法
JP2018206841A (ja) * 2017-05-31 2018-12-27 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

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